1
Eric Strid, K Reed Gleason: Active wafer probe. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, September 23, 2008: US07427868 (23 worldwide citation)

A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may have a rigid probing member and include a flexible interconnection between the active circuit and a support structure. The active circuit may have a relatively low capacitance as seen by the device unde ...


2
Eric Strid, Richard Campbell: Differential signal probing system. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, July 27, 2010: US07764072 (9 worldwide citation)

A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal.


3
Eric Strid, Richard Campbell: On-wafer test structures for differential signals. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, October 28, 2008: US07443186 (7 worldwide citation)

A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street be ...


4
Eric Strid, K Reed Gleason: Active wafer probe. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, July 20, 2010: US07759953 (6 worldwide citation)

A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.


5
Eric Strid, Richard Campbell: Calibration structures for differential signal probing. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, May 25, 2010: US07723999 (4 worldwide citation)

A plurality of calibration structures facilitate calibration of a probing system that includes a differential signal probe having a linear array of probe tips.


6
Kenneth R Smith, Mike Jolley, Eric Strid, Peter Hanaway, K Reed Gleason, Koby L Duckworth: Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same. Cascade Microtech, Dascenzo Intellectual Property Law P C, August 4, 2015: US09099449

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers ...


7
Kenneth R Smith, Mike Jolley, Eric Strid, Peter Hanaway, K Reed Gleason, Koby L Duckworth: Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same. Cascade Microtech, Dascenzo Intellectual Property Law P C, March 3, 2015: US08970240

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers ...


8
Kenneth R Smith, Mike Jolley, Eric Strid, Peter Hanaway, K Reed Gleason, Koby L Duckworth: Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same. Cascade Microtech, Dascenzo Intellectual Property Law P C, January 23, 2018: US09874585

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers ...


9
Eric Strid, K Reed Gleason: Active wafer probe. Cascade Microtech, Chernoff Vilhauer Mcclung & Stenzel, December 18, 2008: US20080309358-A1

A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.


10
Eric Strid, K Reed Gleason: Active wafer probe. Chernoff Vilhauer McClung & Stenzel, June 30, 2005: US20050140386-A1

A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.