1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 10, 2012: US08093697 (76 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


2
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 31, 2013: US08618659 (64 worldwide citation)

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 20, 2014: US08728865 (50 worldwide citation)

A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and expos ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 15, 2011: US08058101 (46 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Ellis Chau, Sang Il Lee, Kishor Desai: No flow underfill. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 15, 2014: US08697492 (12 worldwide citation)

A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and oth ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ellis Chau, Wael Zohni, Richard Dewitt Crisp: Metal can impedance control structure. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 17, 2012: US08222725 (5 worldwide citation)

A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive el ...


7
Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Sean Moran, Wei Shun Wang, Ellis Chau, Christopher Wade: Microelectronic package. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 30, 2012: US08299626 (4 worldwide citation)

A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, September 16, 2010: US20100232129-A1

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


9
Belgacem Haba Belgacem (Bel) Haba
IIyas Mohammed, Belgacem Haba, Sean Moran, Wei Shun Wang, Ellis Chau, Christopher Wade: Microelectronic package. Tessera, Tessera, LERNER DAVID et al, February 19, 2009: US20090045524-A1

A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp: Impedance controlled packages with metal sheet or 2-layer rdl. Tessera Research, March 22, 2012: US20120068338-A1

A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond ...



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