1
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Method of fabricating nendritic materials. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, February 9, 1993: US05185073 (82 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


2
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Separable electrical connection technology. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, August 11, 1992: US05137461 (73 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


3
Volkmar Goetze, Ekkehard F Miersch, Guenther Potz: Electrically switchable permanent storage. International Business Machines Corporation, T Rao Coca, April 24, 1984: US04445202 (67 worldwide citation)

For read-only storages and in particular for PLA applications, improved coupling elements together with an associated personalization scheme permit the storing of at least two memory (or logic) connection patterns selectable independently of each other. Quick electrical switching between at least tw ...


4
Harry R Bickford, Mark F Bregman, Thomas M Cipolla, John Gow III, Peter G Ledermann, Ekkehard F Miersch, Leonard T Olson, David P Pagnani, Timothy C Reiley, Uh Po E Tsou, Walter V Vilkelis: Multilevel integrated circuit packaging structures. International Business Machines Corporation, Daniel P Morris, July 2, 1991: US05028983 (46 worldwide citation)

Electronic device packaging structures useful for electrically interconnecting an electronic device to a substrate. The structure contains at least two metallization layers with dielectric layers between adjacent to metallization layers. The dielectric layers can have variable thickness. Beam leads ...


5
Scott G Ehrenberg, L Wynn Herron, Ekkehard F Miersch, Jae Park, Janet L Poetzinger: Discrete fabrication of multi-layer thin film, wiring structures. International Business Machines Corporation, Whitham & Marhoefer, August 3, 1993: US05232548 (40 worldwide citation)

A multilayer, three-dimensional wiring matrix is fabricated from a plurality of individually testable plane pair sub-units (30). Each of the plane pair sub-units (30) includes a compensator (20) with capping layers (32) laminated on either side. The compensator (20) has a dielectric (14) encapsulate ...


6
Ekkehard F Miersch, Lubomyr T Romankiw: Thin film metal package for LSI chips. International Business Machines Corporation, Graham S Jones II, October 13, 1981: US04295183 (29 worldwide citation)

An integrated circuit board for mounting very high density chips of small size on its top surface including conductor planes for carrying very large values of .DELTA.I (transient current) is constructed with a plurality of essentially flat parallel power planes serving as conductive leads to the chi ...


7
Ekkehard F Miersch, Jae M Park: Forming a pattern on a substrate. International Business Machines, Pollock Vande Sande & Priddy, June 16, 1992: US05122439 (22 worldwide citation)

A pattern is formed on a substrate by providing on the substrate a dielectric composition; defining a pattern in said dielectric; depositing metal and then micromachining the metal to provide the desired pattern on the substrate.


8
Ekkehard F Miersch, Jae M Park: Forming a pattern on a substrate. International Business Machines, Pollock Vande Sande & Priddy, December 22, 1992: US05173392 (11 worldwide citation)

A pattern is formed on a substrate by providing on the substrate a dielectric composition; defining a pattern in said dielectric; depositing metal and then micromachining the metal to provide the desired pattern on the substrate.


9
James N Humenik, Ekkehard F Miersch, Charles H Perry, Janusz S Wilczynski: Method for forming a defect-free surface on a porous ceramic substrate. International Business Machines Corporation, John J Goodwin, July 3, 1990: US04937930 (5 worldwide citation)

A process for hermetically sealing defects in a porous ceramic substrate comprising the steps of evaporating or sputtering a malleable metal layer onto the defective porous ceramic surface, swaging or smearing the malleable metal layer over the defects and depositing a second metal film over the swa ...