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Daniel K Lau, Edward L T Law: Thermal enhanced package for block mold assembly. Advanced Interconnect Technologies, Gregory S Rosenblatt, Wiggin and Dana, August 21, 2007: US07259445 (54 worldwide citation)

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


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Daniel K Lau, Edward L T Law: Thermal enhanced package for block mold assembly. Wiggin And Dana, March 22, 2007: US20070065984-A1

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


3