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Michael Bauer, Peter Strobel, Gerald Ofner, Edward Fürgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


2
Edward Fürgut, Joachim Mahler, Michael Bauer: Semiconductor device including electronic component coupled to a backside of a chip. Infineon Technologies, Dicke Billig & Czaja PLLC, January 8, 2013: US08350382 (9 worldwide citation)

A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled t ...


3
Manfred Mengel, Edward Fürgut, Ralf Otremba, Jürgen Högerl: Electronic component with electronic chip between redistribution structure and mounting structure. Infineon Technologies Austria, July 5, 2016: US09385111

An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive redistribution structure on the electronic chip, and a periphery connection structure electrically coupled to the redistribution structure a ...



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