1
Jeffrey P Baker, Duong T La, Randy A Coverstone: Thermal ink jet pen body construction having improved ink storage and feed capability. Hewlett Packard Company, William J Bethurum, September 13, 1988: US04771295 (445 worldwide citation)

The novel pen body construction described herein includes multiple ink storage compartments communicating with a multi-orifice printhead, and these compartments are adapted to receive sections of ink-storage foam. Preferably, this foam is a reticulated polyurethane foam of controlled porosity and ca ...


2
Jeffrey P Baker, Duong T La, Randy A Coverstone: Thin film resistor type thermal ink pen using a form storage ink supply. Hewlett Packard Company, June 18, 1991: US05025271 (97 worldwide citation)

A disposable thin film resistor type thermal ink jet pen including a housing having a support surface at one end thereof with openings for passing ink to an adjacent thin film resistor type thermal ink jet printhead. The printhead is mounted on the support surface and has ink ejection orifii therein ...


3
Carlos E Bouras, Duong T La, Andre S Gamelin, Alan R Lewis, Mark S Meier, Alec J Babiarz: Flip chip underfill system and method. Nordson Corporation, Wood Herron & Evans L, May 25, 1999: US05906682 (63 worldwide citation)

A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispen ...


4
Janet E Mebane, Lawrence W Chan, Duong T La, Ruben Nevarez: Interconnect lead frame for thermal ink jet printhead and methods of manufacture. Hewlett Packard Company, William J Bethurum, February 21, 1989: US04806106 (40 worldwide citation)

Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the flex circuit and printhead, with the lead frame ...


5
Philip P Maiorca, Mark B Allen, Duong T La: Method and apparatus for dispensing viscous materials. Asymptotic Technologies, Baker Maxham Jester & Meador, November 6, 1990: US04967933 (26 worldwide citation)

A syringe or any other dispensing device is coupled to a conventional dispensing control unit for dispensing viscous material such as adhesives and solder paste through a hollow needle thereof as metered amounts of pressurized gas are supplied to the syringe in response to a valve control signal app ...


6
John Sharpless, Patrick T Hogan, Duong T La: Spray gun with five axis movement. Nordson Corporation, Wood Herron & Evans, August 25, 1992: US05141165 (23 worldwide citation)

An apparatus for manipulating a spray device having a spray nozzle relative to a target substrate, which apparatus includes drive mechanisms for moving the spray device in the X, Y and Z directions, and separate mechanisms for rotating the spray nozzle relative to the spray device and for tilting th ...


7
Carlos E Bouras, Duong T La, Andre S Gamelin, Alan R Lewis, Mark S Meier, Alec J Babiarz: Method of dispensing a viscous material. Nordson Corporation, Wood Herron & Evans L, April 1, 2003: US06541304 (23 worldwide citation)

A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispen ...


8
Carlos E Bouras, Duong T La, Alan R Lewis, Mark S Meier, Alec J Babiarz: Flip chip underfill system and method. Nordson Corporation, Wood Herron & Evans L, October 18, 2005: US06955946 (8 worldwide citation)

A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispen ...


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10
Carlos E Bouras, Duong T La, Alan R Lewis, Mark S Meier, Alec J Babiarz: Flip chip underfill system and method. Nordson Corporation, Wood Herron & Evans, July 24, 2003: US20030137080-A1

A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispen ...