1
Richard P Pashby, Douglas W Phelps Jr, Sigvart J Samuelsen, William C Ward: Package semiconductor chip. International Business Machines Corporation, Francis J Thornton, Theodore E Galanthay, Michael J Weins, August 29, 1989: US04862245 (453 worldwide citation)

The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably ...


2
Douglas W Phelps Jr, Robert J Redmond, William C Ward: Peripheral/area wire bonding technique. International Business Machines Corporation, Sughrue Mion Zinn Macpeak and Seas, January 3, 1989: US04796078 (121 worldwide citation)

An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the firs ...


3
Robert Marks, Douglas W Phelps Jr, William C Ward: Substrate with multiple type connections. International Business Machines Corporation, George Tacticos, Theodore E Galanthay, William N Hogg, May 8, 1984: US04447857 (65 worldwide citation)

A novel substrate is disclosed which can mount either flip-chip solder bonded IC chips or wire bonded chips, or both chips, or a single chip having both solder bonds and wire bonds is disclosed. The substrate has an array of solder pads which will accept solder bonds. Those pads which are to be used ...


4
Friedrich A Karner, Douglas W Phelps Jr, Stephen G Starr, William C Ward: Semiconductor package with ground plane. International Business Machines Corporation, Francis J Thornton, October 23, 1990: US04965654 (58 worldwide citation)

A plastic encapsulated semiconductor package in which the connecting lead frame members are deposited over the surface of the device together with a covering ground plane so as to provide enhanced electrical and thermal coupling of the members and the device and so reduce the signal to noise ratio b ...


5
Judith A Chase, Douglas W Phelps Jr, Robert J Redmond, Stephen G Starr: Single lead automatic clamping and bonding system. International Business Machines, Sughrue Mion Zinn Macpeak and Seas, April 18, 1989: US04821945 (47 worldwide citation)

A system of single lead clamping and bonding in the assembly of integrated circuit devices. A capillary bonder has a clamp member rotatably mounted around the capillary for movement with the bond head. The clamp is moveable vertically to contact and clamp a terminal to be bonded. The clamp is rotata ...


6
Douglas W Phelps Jr, William C Ward: Heat dissipation package for integrated circuits. International Business Machines Corporation, Sughrue Mion Zinn Macpeak & Seas, October 31, 1989: US04878108 (34 worldwide citation)

A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold ejector pins employed to form a recess such that access to the thermally conductive strip is obtained. An ex ...


7
H Ward Conru, Stephen E Gons, Gordon C Osborne Jr, Douglas W Phelps Jr, Stephen G Starr, William C Ward: Method of bonding gold or gold alloy wire to lead tin solder. International Business Machines Corporation, March 13, 1990: US04907734 (28 worldwide citation)

A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in tur ...


8
Robert Marks, Douglas W Phelps Jr, Sigvart J Samuelsen, William C Ward: Highly integrated universal tape bonding. International Business Machines Corporation, Sughrue Mion Zinn Macpeak and Seas, November 12, 1985: US04551912 (16 worldwide citation)

A method of forming semiconductor devices wherein a continuous metallic sheet is cut under computer control into a personalized lead pattern. The pattern is then moved to a bonding station. A bonding tool actuated by computer control moves from one terminal end to another to sequentially bond termin ...


9
Douglas L Lumbra, Douglas W Phelps Jr, Sigvart J Samuelsen, William C Ward: Percussive arc welding. International Business Machines Corporation, Theodore E Galanthay, November 22, 1983: US04417120 (6 worldwide citation)

A method and apparatus for improved percussive arc welding is disclosed. In this technique a test arc of a voltage no greater than the initiating voltage of the percussive arc welding is first applied across the pieces to be welded. The welding cycle is then performed if, and only if, an arc is dete ...