Randy Ekl
David P Gurney, Wayne W Chiou, Randy L Ekl, Douglas H Weisman: Method for addressing user location errors in a cognitive radio system. Motorola, Motorola, March 5, 2009: US20090061779-A1

A cognitive radio (CR) system (102) includes CR units (108, 110) that determine and update location-based system operating parameters to avoid interference with other systems operating in the same frequency band. Operational Location Uncertainty region and Allowed Location Error regions can be appli ...

Ronald C Alford, Robert E Stengel, Douglas H Weisman, George W Marlin: Method of forming a three-dimensional integrated inductor. Motorola, Barbara R Doutre, December 28, 1999: US06008102 (194 worldwide citation)

A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench therein, and filling the trench with electroplated metal (404). A second photoresist layer (408) is deposite ...


David E Bockelman, Douglas H Weisman: Horizontally twisted-pair planar conductor line structure. Motorola, Juliana Agon, Frank M Scutch III, March 14, 1995: US05397862 (27 worldwide citation)

A twisted-pair conductor line structure is formed on a substrate (22) having insulated conductive layers (10, 11). The conductive layers are used to form first, second, third, and fourth conductive planar segments (16). A first conductive link (17) joins the first and second planar conductive segmen ...

David E Bockelman, Douglas H Weisman: Twisted-pair wire bond and method thereof. Motorola, Frank M Scutch III, Juliana Agon, October 17, 1995: US05459284 (15 worldwide citation)

A radio frequency electrical connection between a pair of electrical devices (101, 104) is formed by a pair of bond wires (102, 103) crossing (401) each other.

Douglas H Weisman, Thomas J Swirbel, John K Arledge: Method for fabricating metallization patterns on an electronic substrate. Motorola, Dale W Dorinski, January 7, 1997: US05591480 (13 worldwide citation)

One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking ...

E S Ramakrishnan, Douglas H Weisman: Integrated inductor and capacitor on a substrate and method for fabricating same. Motorola, Dale W Dorinski, June 22, 1999: US05915188 (12 worldwide citation)

An integrated inductor-capacitor (L-C) structure can be formed on a semiconducting substrate (10) by depositing a metal layer in a pattern that contains an inductor coil (14) and a capacitor bottom electrode (12). A CuFe.sub.2 O.sub.4 film (16) is then deposited on the substrate and over the metal p ...

Lawrence N Dworsky, Douglas H Weisman, Loi Q Ninh: Method for tuning piezoelectric resonators. Motorola, Jerry A Miller, Edward M Roney, James W Gillman, June 19, 1984: US04454639 (11 worldwide citation)

A method for adjusting the frequency of a piezoelectic resonator such as a quartz crystal is disclosed. The resonator is placed within its enclosure facing a metallic surface. The atmosphere within the enclosure is made suitable for supporting a glow discharge. An electrical potential is then establ ...

David E Bockelman, Douglas H Weisman: Spatially separated uninsulated twisted wire pair. Motorola, Frank M Scutch III, November 28, 1995: US05471010 (11 worldwide citation)

A radio frequency electrical connection (600) between a pair of electrical devices is formed by a pair of uninsulated bond wires (601, 603). The uninsulated bond wires (601, 603) are twisted in a manner such that the wires form a twisted pair but do not physically touch each other over the length of ...

Douglas H Weisman: Process for forming high aspect ratio circuit features. Motorola, Dale W Dorinski, February 1, 2000: US06020261 (11 worldwide citation)

A method of forming high resolution circuit features on a substrate. A `seed` layer of copper (110) is deposited on a dielectric substrate (100). A dielectric layer (120) is then deposited on the copper layer, and an aluminum `mask` layer (130) is deposited on the dielectric layer. A photoresist lay ...