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David William Sherrer, James MacDonald: Device package and methods for the fabrication thereof. Nuvotronics, Niels Haun, Dann Dorfman Herrell & Skillman PC, March 3, 2015: US08969132 (2 worldwide citation)

Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an ...


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David William Sherrer, James MacDonald: Device Package and Methods for the Fabrication Thereof. March 22, 2012: US20120067871-A1

Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an ...