A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.
A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use p ...
Variations are characterized in feature dimensions of an integrated circuit that is to be fabricated in accordance with a design by a process that produces topographical variation in the integrated circuit, the variations in feature dimension being caused by the topographical variations. The process ...
A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use p ...
A pattern-dependent model is used to predict characteristics of an integrated circuit that is to be fabricated in accordance with a design by a process. The process includes (a) a fabrication process that will impart topographical variation to the integrated circuit and (b) a lithography or etch pro ...
A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use p ...
A mask design is generated for patterning a test wafer using a lithographic or etch process, the process is characterized based on the patterned test wafer, and a pattern-dependent model is used based on the characterization to predict characteristics of integrated circuits that are to be fabricated ...
An electronic design is generated for an integrated circuit that is to be fabricated in accordance with the electronic design by a process that will impart topographically induced feature dimension variations to the integrated circuit. The generating includes adjusting the electronic design based on ...
Variations are characterized in feature dimensions of an integrated circuit that is to be fabricated in accordance with a design by a process that produces topographical variation in the integrated circuit, the variations in feature dimension being caused by the topographical variations. The process ...
A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.
