1
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component comprising an encapsulant. Nuvotronics, Sherr & Vaughn PLLC, August 24, 2010: US07781727 (139 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


2
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component with encapsulant. Rohm and Haas Electronic Materials, Jonathan D Baskin, April 24, 2007: US07208725 (138 worldwide citation)

Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsulant provides an optical surface.


3
David Sherrer
David W Sherrer, Noel A Heiks: Wafer-level optoelectronic device substrate. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 30, 2007: US07288758 (136 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


4
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component with flip-chip mounted optoelectronic device. Samsung Electronics, Sughrue Mion PLLC, November 1, 2011: US08049161 (136 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


5
David Sherrer
David W Sherrer: Microstructures comprising silicon nitride layer and thin conductive polysilicon layer. Shipley Company L L C, Niels Haun, Jonathan D Baskin, March 2, 2004: US06698295 (96 worldwide citation)

Surface micromachined structures having a relatively thick silicon nitride layer and a relatively thin conductive polysilicon layer bonded together. Preferably, the silicon nitride layer and conductive polysilicon layer are made in the same low pressure chemical vapor deposition (LPCVD) step. The po ...


6
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, March 14, 2006: US07012489 (83 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


7
David Sherrer
David W Sherrer, Jean Marc Rollin: Coaxial transmission line microstructures and methods of formation thereof. Nuvotronics, Sherr & Vaughn PLLC, March 1, 2011: US07898356 (46 worldwide citation)

Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have p ...


8
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and method for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 31, 2006: US07129163 (41 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


9
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures having an active device and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, December 12, 2006: US07148772 (38 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


10
David Sherrer
James W Getz, David W Sherrer, John J Fisher: Electronic device packages and methods of formation. Samsung Electronics, Sughrue Mion PLLC, June 19, 2012: US08203207 (34 worldwide citation)

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...



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