1
William L Olson, David W Currier, Tomasz L Klosowiak, Mark Fulcher: Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape. Motorola, Phillip H Melamed, January 31, 1995: US05386341 (147 worldwide citation)

Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configur ...


2
David W Currier, Pavel Pesek: Assembly for circuit modules. Motorola, John H Moore, March 7, 1989: US04811165 (108 worldwide citation)

The assembly includes a heat-conductive plate onto which a pair of circuit modules are mounted, one module on each side of the plate. A continuous piece of flexible material, such as polyimide, forms the substrate for one circuit module, passes around an edge of the plate, and connects to the other ...


3
Sanjar Ghaem, David W Currier: Arrangement for electronic circuit module. Motorola, Phillip H Melamed, March 31, 1992: US05101322 (103 worldwide citation)

Electronic circuit modules (10; 100; 400) have connector (11; 111; 411) with through pins (14, 114; 414) and a metal ground path (17) embedded therein which fit within a recess (24; 124; 424) formed by a heat sink (18; 118; 418) having a central plate portion (19) surrounded by metallic cooling fins ...


4
Tomasz L Klosowiak, David W Currier, Gary K Mui: Flexible circuit board assembly and method. Motorola, Phillip H Melamed, July 18, 1995: US05434362 (48 worldwide citation)

A flexible circuit board assembly (10) includes a flexible substrate (11) having first and second end portions (14,15) and an intermediate portion (16). Conductive metalization interconnect paths (17) extend between the substrate end portions (14, 15) and across the intermediate portion (16). The su ...


5
Maxwell H Case, Lawrence M Hartzell, David W Currier: Heat sink clip and assembly and method of manufacture. Motorola, Phillip H Melamed, February 6, 1990: US04899255 (26 worldwide citation)

A through slot is provided in the central apex portion of a U-shaped heat sink clip and results in an advantageous assembly and method of manufacture. A heat sink and power transistor are clamped together by arm portions of the clip. The slot is used either to permit the passage of an insertion tool ...


6
David W Currier: Integrated circuit carrier and assembly. Motorola, Phillip H Melamed, September 3, 1985: US04539621 (15 worldwide citation)

An integrated circuit (IC) assembly 10 using an IC carrier is disclosed. An IC 15 and IC carrier together form a carrier subassembly 11 in which two parallel rows of IC leads 20 and 21 are received by carrier contacts 28 mounted in openings 27 in a horizontal portion 14 of a main carrier member 13. ...


7
Christopher I McCarthy, David W Currier: Inductor housing. Motorola, Steven G Parmelee, April 14, 1987: US04658091 (6 worldwide citation)

An inductor housing having a platform for supporting an inductor and a standoff unit for supporting the platform away from a conductor board such that various electrical components can be installed on the conductor board between the inductor platform and the conductor board surface. The inductor hou ...


8
David Fiedler, David W Currier, Horace M Long, James V Lowery: System and method for bending a substantially rigid substrate. Motorola, Thomas V Miller, Brian M Mancini, June 21, 2005: US06908583 (1 worldwide citation)

A method and apparatus for bending a substantially rigid substrate (22) having first and second portions (28, 30) interconnected by a bend region (32). The apparatus comprises first and second heated die members (60, 80). The first heated die member (60) has a longitudinal body portion (62) and an o ...


9
David Fiedler, David W Currier, Horace M Long, James V Lowery: System and method for bending a substantially rigid substrate. Motorola, September 16, 2004: US20040178539-A1

A system for bending a substantially rigid substrate (22) having a first portion (28) and a second portion (30) interconnected by a bend region (32). The system comprises a first heated die member (60) and a second heated die member (60). The first heated die member (60) has a longitudinal body port ...