1
David Schoenthaler, Thaddeus Wojcik: Method and apparatus for dispensing viscous materials. AT&T Technologies, R B Levy, November 11, 1986: US04622239 (107 worldwide citation)

An apparatus (28) for dispensing solder paste into openings (26-26) in a stencil (24) comprises a housing (30) having a piston (60) slidably mounted therein. A manifold (70), having a successively increasing cross-sectional area, is attached to a side wall (42) of the housing for admitting a viscous ...


2
David Schoenthaler: Integrated circuit interconnection technique. AT&T Bell Laboratories, Robert B Levy, November 10, 1992: US05162613 (31 worldwide citation)

Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive ma ...


3
David Schoenthaler: Stepped multilayer interconnection apparatus and method of making the same. AT&T Bell Laboratories, Robert B Levy, November 24, 1992: US05165984 (27 worldwide citation)

A stepped multilayer Printed Wiring Board (PWB) (10), having an increased number of wiring paths in selected regions, is comprised of a main multilayer PWB (12) having a sufficient number of layers (12.sub.1,12.sub.2,12.sub.3 . . . 12.sub.n) to provide the lowest number of wiring paths required anyw ...


4
David Schoenthaler, Thaddeus Wojcik: Methods for multipoint dispensing of viscous material. AT&T Technologies, M de Picciotto, D J Kirk, May 7, 1985: US04515297 (25 worldwide citation)

A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (.delta.) between a dispensing tool (20,25) and the board (23), the dispense pressure time cycle within the tool (FIG. 3A) and the tool velocit ...


5
David Schoenthaler: Method and apparatus for forming a uniform solder wave. Western Electric Co, D J Kirk, February 7, 1978: US04072777 (16 worldwide citation)

A tapered array of apertures are provided in a wall of a solder pot to permit passage of molten solder therethrough. Molten solder is pumped along an outside channel, perpendicular to the axes of the apertures, and through the apertures to cause the solder pot to overflow with a uniformly distribute ...


6
David Schoenthaler, Thaddeus Wojcik: Techniques for multipoint dispensing of viscous material. AT&T Technologies, D J Kirk, M de Picciotto, July 1, 1986: US04597420 (11 worldwide citation)

A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (.delta.) between a dispensing tool (20,25) and the board (23), the dispense pressure time cycle within the tool (FIG. 3A) and the tool velocit ...