1
Carmen D Burns, David Roper, James W Cady: Flexible circuit connector for stacked chip module. Staktek Group, J Scott Denko, June 3, 2003: US06572387 (72 worldwide citation)

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral side ...


2
Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Andrews Kurth, J Scott Denko, April 25, 2006: US07033861 (66 worldwide citation)

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


3
Carmen D Burns, David Roper, James W Cady: Flexible circuit connector for stacked chip module. Staktek Group, J Scott Denko, June 27, 2006: US07066741 (65 worldwide citation)

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral side ...


4
Julian Partridge, David Roper, Paul Goodwin: Modified core for circuit module system and method. Entorian Technologies, Civins Denko Coburn & Lauff, July 20, 2010: US07760513 (6 worldwide citation)

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circu ...


5
James Douglas Wehrly Jr, David Roper: Leaded package integrated circuit stacking. Staktek Group, Fish & Richardson P C, J Scott Denko, August 21, 2007: US07259452 (2 worldwide citation)

A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of ...


6
Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Fish & Richardson P C, January 29, 2008: US07323364 (1 worldwide citation)

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


7
Shantharuban Wijeyaratnam, Landale Peter David Roper: Product catalogue production system. Zygon Systems, December 27, 2000: GB2351368-A (1 worldwide citation)

A product catalogue production system comprises a data storage means for storing product data in the form of product codes and associated product attribute data items, said data storage means having a data structure allowing a plurality of product attribute data items to be associated with a product ...


8
Landale Peter David Roper, Shantaruban Wijeyaratnam: Electronic information storage and retrieval system. Zygon Systems, January 22, 2003: GB2377771-A

A system 1 for the storage and retrieval of electronic information, the system comprising: a repository 7 for unstructured storage of a plurality of electronic information items 11; a view applicator 17 for applying a view 19 to said repository, said view defining a structure for one or more of the ...


9
Julian Partridge, James Douglas Wehrly, David Roper: Stacked module systems and method. J Scott Denko, November 23, 2006: US20060263938-A1

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


10
James Douglas Wehrly, David Roper: Leaded package integrated circuit stacking. Staktek Group, J Scott Denko, April 12, 2007: US20070080470-A1

A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of ...