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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi: Reconstituted wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 8, 2011: US07901989 (85 worldwide citation)

A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the f ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Mirkarimi: Off-chip vias in stacked chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 13, 2011: US08076788 (56 worldwide citation)

A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces ...


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Ireland, Lerner David Littenberg Krumholz & Mentlik, May 3, 2011: US07935568 (44 worldwide citation)

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


4
Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 7, 2010: US07791199 (36 worldwide citation)

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston, David Ovrutsky, Laura Mirkarimi: Reconstituted wafer stack packaging with after-applied pad extensions. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 11, 2013: US08461672 (14 worldwide citation)

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Trac ...


6
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz Mentlik, July 6, 2010: US07749886 (8 worldwide citation)

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


7
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 14, 2012: US08115308 (1 worldwide citation)

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


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Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 8, 2011: US08053281 (1 worldwide citation)

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi: Off-chip VIAS in stacked chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 2, 2013: US08476774

A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces ...


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Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 22, 2014: US08704347

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...