1
David L Vos, Ronald J Feduke, Robert L Jennings, Jan M Nielsen: Apparatus facilitating use of cots electronics in harsh environments. December 11, 2001: US06330152 (33 worldwide citation)

An apparatus is provided for permitting commercial-off-the-shelf (COTS) electronics to be utilized in harsh environments for which the COTS electronics are not designed, including environments having ambient temperature variations, ambient pressure variations, shock and vibration exposure, environme ...


2
David L Vos, Francis W Hughto Delzer: Thermally conductive vibration isolators. Lockheed Martin Corporation, Jack V Musgrove, Andrew J Dillon, Robert P Cogan, December 14, 1999: US06002588 (29 worldwide citation)

A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibratio ...


3
Charles H Dando III, Jon Larcheveque, David L Vos: High performance large tolerance heat sink. Lockheed Martin Corporation, Burns & Levinson, Jacob N Erlich Esq, Harvey Kaye Esq, August 9, 2011: US07995344 (21 worldwide citation)

A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of cont ...


4
David L Vos, Randall J Stutzman, Jon Larcheveque, Eugene J Urda: Flow through cooling assemblies for conduction-cooled circuit modules. Lockheed Martin Corporation, Wolf Greenfield & Sacks P C, January 29, 2008: US07324336 (9 worldwide citation)

A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral ...


5
David L Vos, Francis W Hughto Delzer: Thermally conductive vibration isolators. Lockheed Martin Corporation, Andrew J Felsman Bradley Vaden Gunter & Dillon Dillon, November 21, 2000: US06151216 (9 worldwide citation)

A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibratio ...


6
David L Vos: Fluid-cooled module for integrated circuit devices. Lockheed Martin Corporation, Miles & Stockbridge P C, May 20, 2014: US08730673 (5 worldwide citation)

A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devic ...


7
J Claude Caci, David L Vos: Self-sustaining environmental control unit. Lockheed Martin Corporation, Oliff & Berridge, April 10, 2007: US07203574 (4 worldwide citation)

A method and apparatus for housing an electronic device are provided. The apparatus includes an environmentally sealed chamber to protect the electronic device from harsh environments. The environmental conditions of the chamber are controllable using environmental controls which are controlled by d ...


8
William E Murphy, Ryan S Riegle, Richard Shields, David L Vos: Enhanced reliability semiconductor package. Lockheed Martin Corporation, Michael Best & Friedrich, May 18, 2010: US07719108 (2 worldwide citation)

A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solde ...


9
J Claude Caci, David L Vos: Self-sustaining environmental control unit. Lockheed Martin Corporation, Oliff & Berridge, September 18, 2007: US07272468 (1 worldwide citation)

A method and apparatus for housing an electronic device are provided. The apparatus includes an environmentally sealed chamber to protect the electronic device from harsh environments. The environmental conditions of the chamber are controllable using environmental controls which are controlled by d ...


10
William E Murphy, Ryan S Riegle, Richard W Shields, David L Vos: Reliability enhancement process. Lockheed Martin Corporation, Michael Best & Friedrich, March 2, 2010: US07670877 (1 worldwide citation)

A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solde ...