1
Thomas W Bachelder, Dennis R Barringer, Dennis R Conti, James M Crafts, David L Gardell, Paul M Gaschke, Mark R Laforce, Charles H Perry, Roger R Schmidt, Joseph J Van Horn, Wade H White: Segmented architecture for wafer test and burn-in. International Business Machines Corporation, William N Hogg, Robert A Walsh, August 14, 2001: US06275051 (60 worldwide citation)

An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distribut ...


2
Richard J Evans, David L Gardell, Anthony M Palagonia: Method and apparatus for cooling an electronic device. International Business Machines Corporation, Robert A Walsh, April 18, 2000: US06050326 (54 worldwide citation)

A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various m ...


3
Ethan E Gallagher, David L Gardell, Paul M Gaschke: Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing. International Business Machines Corporation, H Daniel Schnurmann, July 11, 2000: US06086387 (36 worldwide citation)

A cover assembly for a socket suitable to accommodate modules of varying thicknesses which can be advantageously used for final test and burn-in test is described. The assembly is characterized by having a low profile and includes a hinged lid; a floating shaft coupled to two cams pivoting on the fl ...


4
Francis E Froebel, David L Gardell, Gary H Irish, Mohammed S Shaikh: Encapsulated semiconductor chip module and method of forming the same. International Business Machines Corporation, Calfee Halter & Griswold, December 17, 1996: US05585600 (28 worldwide citation)

The present invention provides a method for forming an improved lead-on chip semiconductor module and an improved module of this type. In a lead-on chip semiconductor device, a semiconductor chip which has a major surface having input and output bonding pads thereon, is secured to a lead frame havin ...


5
David L Gardell, David C Strippe: High power capacity magnetron cathode. International Business Machines Corporation, Calfee Halter & Griswold, May 13, 1997: US05628889 (13 worldwide citation)

A high power capacity magnetron cathode has coolant fluid control surfaces attached to a supporting structure of a magnet array housed by a magnet array housing. The coolant fluid control surfaces provide radial and axial pumping and circulatory action of liquid coolant introduced into the magnet ar ...


6
John A Fredeman, David L Gardell, Marc D Knox, Mark R LaForce: Actively controlled heat sink for convective burn-in oven. International Business Machines Corporation, Anthony J Canale, Robert A Walsh, James M Leas, January 7, 2003: US06504392 (12 worldwide citation)

A socket for testing or burning-in electronic components has a cover including a heat sink and a sensor. The heat sink and sensor are spring loaded so they make direct, temporary contact to an electronic component in the socket during burn-in. A heat transferring device is coupled to each heat sink. ...


7
Paul J Aube, Normand Cote, Roger G Gamache Jr, David L Gardell, Paul M Gaschke, Marc D Knox, Denis Turcotte: Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test. International Business Machines Corporation, Schmeiser Olsen & Watts, Anthony J Canale, August 21, 2007: US07259580 (10 worldwide citation)

A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after ...


8
David L Gardell, Krisztian Gaspar, Guy C Morin: Co-axial bellows liquid heatsink for high power module test. International Business Machines Corporation, Pollock Vande Sande & Amernick R L, January 16, 2001: US06173760 (9 worldwide citation)

A system for controlling the temperature an electronic component. The system includes a block for temporarily engaging a surface of the component. The block includes channels for circulating a temperature controlling fluid to control a temperature the block and the attached component.


9
David M Audette, David L Gardell, John F Hagios: Method for wafer test and wafer test system for implementing the method. International Business Machines Corporation, Scully Scott Murphy & Presser, Robert A Walsh Esq, April 13, 2004: US06720789 (9 worldwide citation)

A method and system for testing wafers, and particularly a wafer test system employing probes to provide for electrical contact with a device under test (DUT) which is located on a wafer. More particularly, also provided is a method and system for implementing wafer tests where the probes first cont ...


10
Steven E Gardell, David L Gardell, Eric W Gardell: Apparatus and method for monitoring the condition of septic tanks. Mark P White, January 4, 2000: US06012020 (7 worldwide citation)

An electronic sensor for detecting when a septic tank reaches it's design capacity. The sensor uses a sonar transponder to measure the thickness of the three layers of material present in a properly operating septic tank. The sonar transponder is encapsulated in a environmentally sealed sensor assem ...