1
Ronald Patrick Huemoeller, Russ Lie, David Hiner: Two-sided wafer escape package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, July 24, 2007: US07247523 (57 worldwide citation)

A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic compo ...


2
Ronald Patrick Huemoeller, Russ Lie, David Hiner: Two-sided wafer escape package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, September 2, 2008: US07420272 (53 worldwide citation)

A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic compo ...


3
Ronald Patrick Huemoeller, Russ Lie, David Hiner: Two-sided fan-out wafer escape package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, April 6, 2010: US07692286 (51 worldwide citation)

A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic compo ...


4
Michael Kelly, David Hiner, Ronald Huemoeller, Roger St Amand: Semiconductor package and fabricating method thereof. AMKOR TECHNOLOGY, McAndrews Held & Malloy, January 10, 2017: US09543242 (7 worldwide citation)

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.


5
Stephen David Hiner, Rahul Jaikaran Chillar, Bradly Aaron Kippel, Lisa Kamdar Ammann, Jack Thomas Clements, Marcus Carr Walters, Sebastien Cloarec, Marc Malivernay, Liberto Gandia: Filtration system for gas turbines. General Electric Company, Cantor Colburn, May 1, 2012: US08167980 (5 worldwide citation)

A system for use with an inlet of a gas turbine through which airflow toward the gas turbine proceeds is provided and includes a first stage to remove primary aerosol droplets from the airflow by coalescing the primary aerosol droplets into secondary aerosol droplets, which are larger than the prima ...


6
Stephen David Hiner, Rahul Jaikaran Chillar, Bradly Aaron Kippel, Lisa Kamdar Ammann, Jack Thomas Clements, Marcus Carr Walters, Sebastien Cloarec, Marc Malivernay, Liberto Gandia: Filtration system for gas turbines. General Electric Company, Cantor Colburn, May 22, 2012: US08182587 (5 worldwide citation)

A system for use with an inlet of a gas turbine through which an airflow toward the gas turbine proceeds is provided and includes a first self-cleaning stage to remove dust, snow and ice from the airflow, a second water tight stage, disposed downstream from the first stage, to prevent aerosol drople ...


7
Sukianto Rusli, Ronald Patrick Huemoeller, David Hiner: Protruding post substrate package structure and method. Amkor Technology, McKay and Hodgson, Serge J Hodgson, May 15, 2012: US08176628 (5 worldwide citation)

In accordance with one embodiment, a method of forming a protruding post substrate package includes applying a dielectric layer to a carrier. Via apertures are formed in the dielectric layer. Carrier cavities are formed in the carrier using the dielectric layer as a mask. The carrier cavities are li ...


8
Sudhir Ramesh Chaudhari, Jitendra Harish Bijlani, Carlos Serafim Fernandes, Rahul Jaikaran Chillar, Stephen David Hiner: Inlet air filtration system. General Electric Company, Hiscock & Barlclay, April 23, 2013: US08425641 (2 worldwide citation)

Embodiments of the present invention provide an inertial filtration system for air-ingesting machines. The inertial filter 100 may comprise a reducer 133 downstream of a vortex generator. The reducer 133 decreases the area that the airstream flows through, which may increase the angular momentum and ...


9
David Hiner, Michael Kelly, Ronald Huemoeller: Semiconductor package and fabricating method thereof. McAndrews Held & Malloy, May 16, 2017: US09653428 (2 worldwide citation)

A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plura ...


10
Michael Kelly, David Hiner, Ronald Huemoeller, Roger St Amand: Semiconductor package and fabricating method thereof. AMKOR TECHNOLOGY, McAndrews Held & Malloy, December 26, 2017: US09852976 (1 worldwide citation)

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.