1
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, David Gibson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 10, 2011: US07939934 (17 worldwide citation)

An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from ...


3
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, David Gibson: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, November 9, 2006: US20060249857-A1

An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from ...


5
Belgacem Haba Belgacem (Bel) Haba
David Gibson, Giles Humpston, Belgacem Haba: Soldered assemblies and methods of making the same. Tessera, Tessera, LERNER DAVID et al, December 14, 2006: US20060278997-A1

A microelectronic element is mounted to a substrate using solder elements disposed at least partially within vias of the substrate. The vias have tapering walls. During reflow of the solder, the microelectronic element may move toward the substrate. Such movement may be impelled, for example, by int ...


6
Thomas H DiStefano, Gary W Grube, Igor Y Khandros, Gaetan Mathieu, Jason Sweis, Laurie Union, David Gibson: Connection components with frangible leads and bus. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 25, 2000: US06054756 (109 worldwide citation)

A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned appro ...


7
L Elliott Pflughaupt, David Gibson, Young Gon Kim, Craig S Mitchell, Wael Zohni, Ilyas Mohammed: Stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 20, 2005: US06977440 (90 worldwide citation)

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces whic ...


8
David Gibson, Michael Lerner, Robert Nordquist, Cary Reich: Treated corneal prosthetic device. Chiron Ophthalmics, Rothwell Figg Ernst & Kurz, December 15, 1992: US05171318 (81 worldwide citation)

Prosthetic devices are prepared for subepithelial implantation by coating their surfaces with a coating comprising crosslinked or uncrosslinked fibronectin. If the surface of the device comprises a material which does not normally bind fibronectin, it is pretreated, for example, by coating with poly ...


9
Bruce David Gibson, Kent Lee Ubellacker: Alignment system and method of compensating for skewed printing in an ink jet printer. Lexmark International, Needle & Rosenberg P C, August 28, 2001: US06281908 (80 worldwide citation)

A method of printing with an ink jet printer compensates for skewed printing on a print medium An image area is defined on the print medium that has a plurality of rows of pixel locations and a plurality of columns of pixel locations. A printhead includes a plurality of vertically adjacent ink emitt ...


10
Kyong Mo Bang, David Gibson, Young Gon Kim, John B Riley: Components, methods and assemblies for stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 13, 2007: US07294928 (78 worldwide citation)

A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to ...



Click the thumbnails below to visualize the patent trend.