1
Zachary J Lemnios, David G McIntyre, Chung Lim Lau, Dennis A Williams: Three metal personalization of application specific monolithic microwave integrated circuit. Ford Microelectronics, Evenson Wands Edwards Lenahan & McKeown, September 25, 1990: US04959705 (119 worldwide citation)

A (GaAs-resident) application specific monolithic microwave integrated circuit (ASMMIC) is fabricated through the use of footprints that include a portion of the metallization through which the circuit components within the wafer are to be interconnected. The metallization is a three layers structur ...


2
Xia Zhang, David G McIntyre, William Chi Keung Tang: Fabrication method for encapsulated micromachined structures. Ford Motor Company, Mark L Mollon, November 14, 2000: US06146917 (56 worldwide citation)

A process for the preparation of hermetically sealed electronically active microstructures involves the preparation of a plurality of microstructures and associated conductive paths and lead bond areas on a single wafer such that areas surrounding the microstructures are maintained in a planar condi ...


3
Zachary J Lemnios, David G McIntyre, Chung Lim Lau, Dennis A Williams: Three metal personalization of application specific monolithic microwave integrated circuit. November 10, 1992: US05162258 (51 worldwide citation)

A (GaAs-resident) application specific monolithic microwave integrated circuit (ASMMIC) is fabricated through the use of footprints that include a portion of the metallization through which the circuit components within the wafer are to be interconnected. The metallization is a three layers structur ...


4
Judd S Carper, David G McIntyre: Hermetic seal for an electronic component having a secondary chamber. Ford Motor Company, Jospeh W Malleck, November 17, 1998: US05837935 (13 worldwide citation)

A hermetic seal for an electronic component has a cap having a base portion with laterally extending walls. The laterally extending walls define a main chamber therebetween. A cavity is formed in the end of the laterally extending walls to define a secondary chamber and divide the end of the lateral ...


5
Vladimir H Pavlecka, David G McIntyre: Air transport and lifting vehicle. Skagit Corporation, Robert C Smith, September 19, 1978: US04114837 (13 worldwide citation)

An air lifting vehicle includes, inter alia, a main frame containing an engine, a helicopter-type rotor driven by the engine, a rear located propeller which provides torque compensation for the rotor as well as yaw control for the vehicle, and a pilot's cabin. Attached to the frame through a plurali ...


6
Chee Siong Peh, Chiew Hai Ng, David G McIntyre: Systems and methods for plasma etching compound semiconductor (CS) dies and passively aligning the dies. Avago Technologies General IP, May 19, 2015: US09034734

Methods are provided for using masking techniques and plasma etching techniques to dice a compound semiconductor wafer into dies. Using these methods allows compound semiconductor die to be obtained that have smooth side walls, a variety of shapes and dimensions, and a variety of side wall profiles. ...