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Yasuyuki Naito, Masaaki Taniguchi, Yoichi Kuroda, Haruo Hori, David G Figueroa, Jorge P Rodriguez, Nicholas R Watts, Nicholas L Holmberg, Takashi Hioki: Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same. Murata Manufacturing, Intel Corporation, Keating & Bennett, August 12, 2003: US06606237 (135 worldwide citation)

A multilayer capacitor is constructed to minimize equivalent series inductance (ESL) and to achieve large capacitance. The capacitor includes first and second main go surface terminal electrodes provided on a first main surface of the main body of the multilayer capacitor. First and second side surf ...


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David G Figueroa, Michael Walk, Yuan Liang Li, Robert L Sankman: Electronic assembly with trench structures and methods of manufacture. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, May 14, 2002: US06388207 (86 worldwide citation)

To accommodate the operational and structural requirements of high performance integrated circuits, an integrated circuit package includes conductive trenches that are formed within a substrate. The trenches provide increased current carrying capacity, lower inductance, higher capacitance, and singl ...


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David G Figueroa, Yuan Liang Li, Huong T Do: Hybrid capacitor and method of fabrication therefor. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, September 10, 2002: US06446317 (79 worldwide citation)

A hybrid capacitor associated with an integrated circuit package provides multiple levels of excess, off-chip capacitance to die loads. The hybrid capacitor includes a low inductance, parallel plate capacitor embedded within the package, and electrically connected to a second source of off-chip capa ...


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David G Figueroa, Yuan Liang Li, Chee Yee Chung: Embedded capacitor assembly in a package. Intel, Antonelli Terry Stout & Kraus, February 12, 2002: US06346743 (56 worldwide citation)

A capacitor assembly having one or more capacitors embedded in the core layer of a package having integrated circuits (ICs) mounted thereon. Each embedded capacitor has plural pairs of first and second electrodes and the package core layer has plural sets of first and second vias dispersed over the ...


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P R Patel, Yuan Liang Li, David G Figueroa, Shamala Chickamenahalli, Huong T Do: Dual-socket interposer and method of fabrication therefor. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, April 2, 2002: US06366467 (50 worldwide citation)

An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer. The second set of pins provide inputs and outputs to an integrated circuit mounted on the interposer. On ...


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Yuan Liang Li, David G Figueroa: Interconnected series of plated through hole vias and method of fabrication therefor. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, December 10, 2002: US06493861 (36 worldwide citation)

A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, elec ...


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Kishore K Chakravorty, Paul H Wermer, David G Figueroa, Debabrata Gupta: Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, August 10, 2004: US06775150 (29 worldwide citation)

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed ...


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Yuan Liang Li, Chee Yee Chung, David G Figueroa: Embedded enclosure for effective electromagnetic radiation reduction. Intel Corporation, Blakely Sokoloff Taylor & Zafman, May 6, 2003: US06559484 (28 worldwide citation)

In one embodiment of the invention, an embedded enclosure includes a power plane and first and second ground planes. The power plane has a power surface and a power periphery, and couples power to signals of an integrated circuit operating at a fundamental frequency. The first and second ground plan ...