1
Rathindra N Putatunda, David C Smith, Stephen A McNeary: Structured design method for high density standard cell and macrocell layout of VLSI chips. General Electric Company, Clement A Berard Jr, William H Meise, March 21, 1989: US04815003 (140 worldwide citation)

A chip layout system lays out chips including adjustable-shaped domains of standard cells and fixed-size macrocells. The system orders those standard cells which have interconnections into binary pairs or groupings of two. The binary pairs are grouped in higher and higher order groupings based upon ...


2
Rathindra N Putatunda, David C Smith, Stephen A McNeary: Structured design method for generating a mesh power bus structure in high density layout of VLSI chips. General Electric Company, Clement A Berard Jr, William H Meise, March 7, 1989: US04811237 (98 worldwide citation)

An automated LSI chip layout arrangement includes automated layout of the power bus distribution network. A complete interlocking mesh of buses is run in routing channels lying between groups of circuits to be powered. Each segment of the mesh powering net which affects the chip size is tested to se ...


3
David C Smith, Richard Noto: Routing method in computer aided customization of a two level automated universal array. The United States of America represented by the Secretary of the Army, Anthony T Lane, Jeremiah G Murray, Robert A Maikis, September 23, 1986: US04613941 (83 worldwide citation)

A routing method implemented in the stored programs of a digital computer ich is programmably operated to generate the wire interconnect masks for a two level metallization automated universal array having undefined roadbeds between rows of cells comprised of identical semiconductor device basic uni ...


4
Allen Cypher, David C Smith, James C Spohrer: Extensible simulation system and graphical programming method. Apple Computer, Carr DeFilippo & Ferrell, October 15, 1996: US05566295 (68 worldwide citation)

An extensible simulation system and graphical programming method enable a simulation user to program the behaviors of objects in a simulation while requiring no knowledge of computer programming concepts or languages. The simulation user defines each object's behaviors by creating Graphical Rewrite ...


5
David C Smith, Richard Noto: Automatic layout program for hybrid microcircuits (HYPAR). The United States of America represented by the Secretary of the Army, Anthony T Lane, Jeremiah G Murray, Robert A Maikis, February 19, 1985: US04500963 (62 worldwide citation)

A computer program for the fully automatic layout of hybrid microcircuits. he program, under certain options, guarantees one-hundred percent routing connectivity for components ranging from discretes to VLSI. Special features such as bottom-up or top-down routing, sequential level routing and user-d ...


6
Charles M Lieber, Xiangfeng Duan, Yi Cui, Yu Huang, Mark Gudiksen, Lincoln J Lauhon, Jianfang Wang, Hongkun Park, Qingqiao Wei, Wenjie Liang, David C Smith, Deli Wang, Zhaohui Zhong: Nanoscale wires and related devices. President and Fellows of Harvard College, Wolf Greenfield & Sacks PC, November 27, 2007: US07301199 (59 worldwide citation)

The present invention relates generally to sub-microelectronic circuitry, and more particularly to nanometer-scale articles, including nanoscale wires which can be selectively doped at various locations and at various levels. In some cases, the articles may be single crystals. The nanoscale wires ca ...


7
Richard Noto, David C Smith: Logic cell placement method in computer-aided-customization of universal arrays and resulting integrated circuit. RCA Corporation, Clement A Barard Jr, Raymond E Smiley, Robert Ochis, August 11, 1987: US04686629 (53 worldwide citation)

An improved automatic placement process for placing logic cells in a universal array. Unused basic units are assigned to rows to reduce the congestion of the wiring in high congestion regions of a universal array. These assigned unused basic units are allocated among rows in a pyramidal manner. Thos ...


8
Alfred Mak, Ling Chen, David C Smith, Mei Chang, Steve Ghanayem: Deposition of tungsten nitride by plasma enhanced chemical vapor deposition. Applied Materials, Thomason Moser & Patterson, October 30, 2001: US06309713 (52 worldwide citation)

A layer of tungsten nitride is deposited on the upper surface of a wafer. The deposition is performed by providing a gaseous mixture and providing energy to the gaseous mixture to form a plasma. The gaseous mixture includes a first gaseous composition containing tungsten and a second gaseous composi ...


9
Jonathan D Reid, Steven T Mayer, Seshasayee Varadarajan, David C Smith, Evan E Patton, Dinesh S Kalakkad, Gary Lind: Methods and apparatus for controlled-angle wafer immersion. Novellus Systems, Beyer Weaver & Thomas, April 22, 2003: US06551487 (48 worldwide citation)

The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electro ...


10
David C Smith, Stevan G Pattillo, Joseph R Laia Jr, Alfred P Sattelberger: Vapor deposition of thin films. The United States of America represented by the United States Department of Energy, Bruce H Cottrell, Paul D Gaetjens, William R Moser, September 22, 1992: US05149596 (46 worldwide citation)

A highly pure thin metal film having a nanocrystalline structure and a process of preparing such highly pure thin metal films of, e.g., rhodium, iridium, molybdenum, tungsten, rhenium, platinum, or palladium by plasma assisted chemical vapor deposition of, e.g., rhodium(allyl).sub.3, iridium(allyl). ...



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