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Belgacem Haba Belgacem (Bel) Haba
Bruce M McWilliams, Giles Humpston, Belgacem Haba, David B Tuckerman: Structure and method of making sealed capped chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 20, 2007: US07298030 (44 worldwide citation)

A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 9, 2008: US07462936 (32 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


3
Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 29, 2007: US07224056 (23 worldwide citation)

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, March 26, 2013: US08405196 (21 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, November 13, 2012: US08310036 (18 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


6
Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, LErner David Littenberg Krumholz & Mentlik, May 4, 2010: US07709968 (17 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


7
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, David B Tuckerman, Belgacem Haba, Giles Humpston, Jesse Burl Thompson: Pin referenced image sensor to reduce tilt in a camera module. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 22, 2009: US07593636 (12 worldwide citation)

The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit inc ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, David B Tuckerman, Giles Humpston, Richard Dewitt Crisp: Methods for forming connection structures for microelectronic devices. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 14, 2010: US07793414 (10 worldwide citation)

Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a bas ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Glenn Urbish, David B Tuckerman: Structure and method of forming capped chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 1, 2008: US07351641 (5 worldwide citation)

As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form t ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, David B Tuckerman, Giles Humpston, Richard Dewitt Crisp: Connection structures for microelectronic devices and methods for forming such structures. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 28, 2007: US07262368 (5 worldwide citation)

Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a bas ...



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