1
David A Hanson, Ross A Longhini, Daniel D McPhillips, Steven J Seme: Bone implants and methods. Zimmer Spine, Faegre & Benson, March 28, 2006: US07018416 (196 worldwide citation)

Implants, instruments and methods for bone fusion procedures are disclosed. In some embodiments, the implants are particularly advantageous for use between opposing vertebral bodies to facilitate stabilization or arthrodesis of an intervertebral joint. The implants include, at least, a support compo ...


2
David A Hanson: Method for reducing via inductance in an electronic assembly and article. W L Gore & Associates, Victor M Genco Jr, February 8, 2000: US06021564 (153 worldwide citation)

A method of making a low inductance conductive via in a laminated substrate by providing a first conductive layer. A first dielectric layer is formed on the first conductive layer. A second conductive layer is formed on the first dielectric layer. A first conductive path is formed in the first condu ...


3
David A Hanson, Ross A Longhini, Steven J Seme: Bone preparation instruments and methods. Sulzer Spine Tech, Merchant & Gould PC, October 21, 2003: US06635060 (123 worldwide citation)

Instruments and methods for preparing adjacent bones for fusion, and for inserting implants are disclosed. In one embodiment, the instruments include paddles for spacing the adjacent bones a predetermined distance and a cutting edge to create a channel between the adjacent bones to receive a fusion ...


4
David A Hanson, Ross A Longhini, Steven J Seme: Bone preparation instruments and methods. Sulzer Spine Tech, Merchant & Gould P C, November 4, 2003: US06641582 (98 worldwide citation)

Instruments and methods for preparing adjacent bones for fusion are disclosed. In a typical embodiment, the instruments include paddles for spacing the adjacent bones a predetermined distance and a cutting edge to create a channel between the adjacent bones to receive a fusion implant. The instrumen ...


5
David A Hanson, Raed N Rizq, Jodi L Balik, Samira Tahvildari, Mandar G Sukhatankar, William K Durfee, Arthur G Erdman: Radio frequency ablation apparatus with remotely articulating and self-locking electrode wand. Sulzer Medica USA, Christopher R Kirby, Timothy L Scott, Kenneth S Barrow, July 23, 2002: US06423059 (80 worldwide citation)

A radio frequency ablation apparatus having an application wand which is articulating and self-locking in a selected configuration. The wand has a handle having a thumb wheel apparatus. A threaded bore extends coaxially through the thumb wheel. A threaded tube received in the threaded bore translate ...


6
Mark F Sylvester, David A Hanson, William G Petefish: Interconnect module with reduced power distribution impedance. 3M Innovative Properties Company, Melanie G Gover, January 25, 2005: US06847527 (45 worldwide citation)

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated cir ...


7
Edward C Priest, Steven C Barber, Ken Shintaku, David A Hanson, Dan L Massopust: Clock distribution apparatus and processes particularly useful in multiprocessor systems. Cray Research, Merchant Gould Smith Edell Welter & Schmidt, March 8, 1994: US05293626 (42 worldwide citation)

Clock pulses from a master oscillator are distributed in a multiprocessor computer system so that they arrive at a large number of utilization points located in operating clusters of modules within extremely tight time tolerances of each other. The delays associated with each component, electrical o ...


8
Charanpreet S Bagga, David A Hanson, Dale L Brady: Bone instruments and methods. Sulzer Spine Tech, Merchant & Gould PC, January 13, 2004: US06676662 (37 worldwide citation)

Bone guides for sizing or shaping bone are disclosed. The guides can be configured and sized for placement on a surgery table, instrument table or similar structure in an operating room. The guides provide for real time preparation of a bone graft during a surgical procedure.


9
David A Hanson: Method for reducing via inductance in an electronic assembly and article. W L Gore & Associates, Victor M Genco Jr, November 24, 1998: US05841075 (34 worldwide citation)

A method of making a low inductance conductive via in a laminated substrate by providing a first conductive layer. A first dielectric layer is formed on the first conductive layer. A second conductive layer is formed on the first dielectric layer. A first conductive path is formed in the first condu ...


10
Christopher M Banick, Jack A Dant, David A Hanson, Rodney L Houfburg: Skeletal stabilization implant. Zimmer Spine, Wood Herron & Evans, October 24, 2006: US07125424 (27 worldwide citation)

A spinal implant is described in this disclosure. The implant includes first and second pieces separated by a controlled break location. Spinal implant kits having multiple spinal implant pieces derived from a common source also are disclosed.