1
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, April 28, 2015: US09017481 (128 worldwide citation)

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


2
Dave Marquardt, Sooyun Joh, David Cohen, Edward J McInerney: Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device. Novellus Systems, Ingrassia Fisher & Lorenz PC, July 19, 2005: US06918824 (5 worldwide citation)

An assembly for a chemical-mechanical polishing process includes a platen having an outer edge, a top surface, and at least one inlet for introducing fluid to the top surface; a manifold system, entrenched in the top surface and in communication with the at least one inlet, for channeling the fluid ...


3
Stephen C Schultz, John D Herb, Dave Marquardt: Platen and manifold for polishing workpieces. Novellus Systems, Ingrassia Fisher & Lorenz PC, May 9, 2006: US07040957 (2 worldwide citation)

In a chemical mechanical wafer processing apparatus, a platen for supporting a polishing pad, a manifold for delivering a chemical to the platen, a workpiece substantially in contact with a polishing pad supported by the platen, a light transmission medium for transmitting and receiving light to and ...


4
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, February 13, 2018: US09892908

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


5
Dave Marquardt, Sooyun Joh, David Cohen, Edward J McInerney: Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device. Ingrassia Fisher & Lorenz PC, March 31, 2005: US20050070214-A1

An assembly for a chemical-mechanical polishing process includes a platen having an outer edge, a top surface, and at least one inlet for introducing fluid to the top surface; a manifold system, entrenched in the top surface and in communication with the at least one inlet, for channeling the fluid ...


6
Stephen C Schultz, John D Herb, Dave Marquardt: Platen and manifold for polishing workpieces. Ingrassia Fisher & Lorenz PC, February 19, 2004: US20040033759-A1

In a chemical mechanical wafer processing apparatus, a platen for supporting a polishing pad, a manifold for delivering a chemical to the platen, a workpiece substantially in contact with a polishing pad supported by the platen, a light transmission medium for transmitting and receiving light to and ...



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