1
Dapeng Wang, James Hofmann: Methods of forming semiconductor devices and methods of forming field emission displays. Micron Technology, Wells St John Roberts Gregory & Matkin P S, February 20, 2001: US06190929 (61 worldwide citation)

In one aspect, the invention encompasses a method of forming a semiconductor device. A masking material is formed over a semiconductor substrate. A mold is provided, and the mold has a first pattern defined by projections and valleys between the projection. The masking material is pressed between th ...


2
Dapeng Wang: Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies. Micron Technology, Perkins Coie, December 24, 2002: US06498101 (59 worldwide citation)

Planarizing pads and methods for making or using planarizing pads to polish or planarize semiconductor wafers, field emission displays, or other microelectronic substrates and substrate assemblies. In one embodiment, the planarizing pad comprises a compressible body and a plurality of discrete conta ...


3
Dapeng Wang: Deformable pad for chemical mechanical polishing. Micron Technology, TraskBritt, December 23, 2003: US06666751 (9 worldwide citation)

The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present inventio ...


4
Dapeng Wang: Chemical mechanical polishing pads. Micron Technology, TraskBritt, August 4, 2009: US07568970 (8 worldwide citation)

The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present inventio ...


5
Dapeng Wang: Chemical mechanical polishing apparatus and methods for chemical mechanical polishing. Micron Technology, TraskBritt, March 6, 2007: US07186168 (3 worldwide citation)

The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present inventio ...


6
David Tanner, Hien Minh Huu Le, Quancheng, Shuran Sheng, Yong Kee Chae, Tzay Fa, Dapeng Wang: Method of manufacturing thin film solar cells having a high conversion efficiency. Applied Materials, Patterson & Sheridan, August 28, 2012: US08252624 (3 worldwide citation)

A method and apparatus for forming solar cells is provided. In one embodiment, a photovoltaic device includes a antireflection coating layer disposed on a first surface of a substrate, a barrier layer disposed on a second surface of the substrate, a first transparent conductive oxide layer disposed ...


7
Hongli Dai, Huiming Wu, Dapeng Wang: Cathode active materials having improved particle morphologies. Apple, Polsinelli PC, September 25, 2018: US10084187 (1 worldwide citation)

Mixed-metal oxides and lithiated mixed-metal oxides are disclosed that involve compounds according to, respectively, NixMnyCozMeαOβ and Lii+γNixMnyCozMeαOβ. In these compounds, Me is selected from B, Na, Mg, Al, Si, K, Ca, Sc, Ti, V, Cr, Fe, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Ru, Ag, In, and combinations t ...


8
Dapeng Wang: Vector 3-component 3-dimensional kirchhoff prestack migration. Baker Hughes Incorporated, Madan Mossman & Sriram P C, June 2, 2009: US07542373 (1 worldwide citation)

An apparatus and a method for migration of three components, 3-Dimensions seismic (3-C, 3-D) data acquired by down-hole receivers and surface seismic sources. This method utilizes full 3 components reflection wave field. It uses a dynamic, vector energy mapping method to image a reflection position ...


9
Danny Cam Toan Lu, Michel Marriott, Vicky Svidenko, Dapeng Wang, Michel R Frei: Solar parametric testing module and processes. Applied Materials, Patterson & Sheridan L, November 1, 2011: US08049521 (1 worldwide citation)

Embodiments of the present invention generally relate to a module that can test and analyze various regions of a solar cell device in an automated or manual fashion after one or more steps have been completed in the solar cell formation process. The module used to perform the automated testing and a ...


10
Huiming Wu, Hongli Dai, Dapeng Wang, Christopher S Johnson, John David Carter, Yanjie Cui, Arturo Gutierrez, Hakim H Iddir, Arthur Jeremy Kropf, Yan Li, Victor A Maroni, Anh D Vu, Xiaoping Wang, Zhenzhen Yang: Cathode active materials for lithium-ion batteries. Apple, Polsinelli PC, November 27, 2018: US10141572

Compounds, powders, and cathode active materials that can be used in lithium ion batteries are described herein. Methods of making such compounds, powders, and cathode active materials are described.