1
Joel R Bitler, Michael W Bodnar, Raymond H Booth, Daniel J Roman, Fred J Schneider, Philip W Seitzer, George F Wilkinson Jr: Article carrying a distinctive mark. Western Electric Co, W O Schellin, August 10, 1982: US04344064 (61 worldwide citation)

A Hybrid Integrated Circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) und ...


2
Joel R Bitler, Michael W Bodnar, Raymond H Booth, Daniel J Roman, Fred J Schneider, Philip W Seitzer, George F Wilkinson Jr: Methods of marking and electrically identifying an article. Western Electric Company, W O Schellin, March 20, 1984: US04437229 (23 worldwide citation)

A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) und ...