1
Dana Gronbeck Jeffrey Calvert
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Electronic devices having air gaps. Rohm and Haas Electronic Materials, Jonathan D Baskin, May 25, 2010: US07723850 (8 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


2
Dana Gronbeck Charles Szmanda
Lujia Bu, Emine Cagin, Chandra Cutler, Dana A Gronbeck, Charles R Szmanda: Memory devices based on electric field programmable films. Rohm And Haas Company, September 29, 2005: US20050211978-A1

Disclosed herein is an electric field programmable film comprising a polymer bonded to an electroactive moiety. Disclosed herein too is a method of manufacturing an electric field programmable film comprising depositing upon a substrate, a composition comprising a polymer and an electroactive moiety ...


3
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Gregory P Prokopowicz, Timothy G Adams: Electronic device manufacture. Shipley Company L L C, S Matthew Cairns, March 28, 2006: US07018678 (30 worldwide citation)

Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.


4
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company L L C, Jonathan D Baskin, August 14, 2007: US07256127 (25 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


5
Dana Gronbeck
Dana A Gronbeck, George G Barclay, Leo L Linehan, Kao Xiong, Subbareddy Kanagasabapathy: Photoimageable composition. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards & Angell, October 12, 2004: US06803171 (25 worldwide citation)

Disclosed are photoimageable compositions containing silsesquioxane binder polymers and photoactive compounds, methods of forming relief images using such compositions and methods of manufacturing electronic devices using such compositions. Such compositions are useful as photoresists and in the man ...


6
Dana Gronbeck
James F Cameron, Dana A Gronbeck, George G Barclay: Multilayer photoresist systems. Rohm and Haas Electronic Materials, Peter F Corless, Darryl P Frickey, Edwards Angell Palmer & Dodge, September 1, 2009: US07582412 (16 worldwide citation)

Multilayer photoresist systems are provided. In particular aspects, the invention relates to underlayer composition for an overcoated photoresist, particularly an overcoated silicon-containing photoresist. Preferred underlayer compositions comprise one or more resins or other components that impart ...


7
Dana Gronbeck
Dana A Gronbeck, Kathleen M O Connell, William Andrew Burke, Michael N Gaudet, Stefan J Caporale: Process for removing heavy metal ions by ion exchange. Shipley Company L L C, Robert L Goldberg, December 30, 1997: US05702611 (7 worldwide citation)

The invention is for a process of removing dissolved heavy metal cation contaminants from an organic solution. The process of the invention involves providing a mixture of a chelating ion exchange resin modified by removal of sodium ions therefrom and an anion exchange resin and contacting said orga ...


8
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company, Edwards & Angell, July 15, 2004: US20040137728-A1 (2 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


9
Dana Gronbeck
Dana A Gronbeck, Suzanne Coley, Chi Q Truong, Ashish Pandya: Reduction of inorganic contaminants in polymers and photoresist compositions comprising same. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards & Angell, August 10, 2004: US06773872 (2 worldwide citation)

The present invention provides polymers which are substantially or completely free of inorganic contaminants and the use of such polymers as a resin component for photoresist compositions, particularly chemically-amplified positive-acting resists. Polymers of the invention also are suitable for use ...


10
Dana Gronbeck
Dana A Gronbeck, George G Barclay, Leo L Linehan, Kao Xiong, Subbareddy Kanagasabapathy: Photoimageable composition. Shipley Company, Edwards & Angell, February 3, 2005: US20050026077-A1

Disclosed are photoimageable compositions containing silsesquioxane binder polymers and photoactive compounds, methods of forming relief images using such compositions and methods of manufacturing electronic devices using such compositions. Such compositions are useful as photoresists and in the man ...