1
David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Daurtartas, Robert G Schinazi: Fiber array with V-groove chip and mount. Shipley Company L L C, Johnthan D Baskin, November 16, 2004: US06819858 (25 worldwide citation)

A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommoda ...


2

3
David Sherrer
David W Sherrer, Gregory A Ten Eyck, Dan A Steinberg, Neal Ricks: Single mask technique for making positive and negative micromachined features on a substrate. Shipley Company L L C, Jonathan D Baskin, September 30, 2003: US06627096 (17 worldwide citation)

Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. ...


4
David Sherrer
Hui Luo, Mindaugas F Dautartas, Dan A Steinberg, David W Sherrer: Optical waveguide termination with vertical and horizontal mode shaping. Shipley Company L L C, Jonathan D Baskin, July 31, 2007: US07251406 (11 worldwide citation)

An optical device is disclosed which includes a single-mode waveguide (700) which supports a first optical mode in a first region and a second optical mode in a second region. The waveguide includes a guiding layer (703) having at least one wing (750) extended outwardly from the guiding layer (703). ...


5
David Sherrer
David W Sherrer, Dan A Steinberg, Mindaugas F Dautartas: Optical fiber array for preventing flow of glue between fibers and waveguide. Shipley Company, Brown Rudnick Berlack Israels, February 25, 2003: US06526204 (11 worldwide citation)

An optical fiber array having wick stop grooves in a front face of the array. The wick stop grooves control the movement of liquid adhesive (e.g. UV curable adhesive, solder, sol-gel). Particularly, the wick stop grooves prevent liquid adhesive from flowing between the optical fibers in the array an ...


6
David Sherrer
David W Sherrer, Mindaugus F Dautargas, Neil Ricks, Dan A Steinberg: Wafer level packaging for optoelectronic devices. Shipley Company L L C, Jonathan D Baskin, March 18, 2008: US07345316 (8 worldwide citation)

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a li ...


7
David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Dautartas: Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts. Shipley Company L L C, Jonathan D Baskin, March 15, 2005: US06866426 (8 worldwide citation)

An optical fiber array having a V-groove chip with a front portion and a rear portion. The optical fibers are disposed in the V-grooves. The optical fibers are bnonded (e.g. glued) to the V-groove chip in the rear portion of the chip. The optical fibers are not bonded to the front portion of the chi ...


8
David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Dautargas: Optical device package. Shipley Company L L C, Jonathan D Baskin, August 23, 2005: US06932519 (7 worldwide citation)

An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in the substrate such that the tap surface of the opt ...


9

10
David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Dautartas, Arden Jeantilus: Optical assembly for coupling with integrated optical devices and method for making. Shipley Company L L C, Jonathan D Baskin, January 4, 2005: US06839474 (6 worldwide citation)

An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is posi ...



Click the thumbnails below to visualize the patent trend.