1
Taylor R Efland, Dave Cotton, Dale J Skelton: ESD protection structure using LDMOS diodes with thick copper interconnect. Texas Instruments Incorporated, Mark E Courtney, W James Brady III, Richard L Donaldson, November 21, 1995: US05468984 (167 worldwide citation)

An interconnection structure and method for a multiple zener diode ESD protectoin circuit for power semiconductor devices. A plurality of lateral Zener diodes is formed. Each device is formed of a plurality of cathode and anode diffusion regions to be coupled together to form the cathode and anode o ...


2
Taylor R Efland, David Cotton, Dale J Skelton: Multiple transistor integrated circuit with thick copper interconnect. Texas Instruments Incorporated, Mark E Courtney, W James Brady III, Richard L Donaldson, January 12, 1999: US05859456 (45 worldwide citation)

An interconnection structure and method for a multiple transistor integrated circuit power device is disclosed. A power integrated circuit is formed of a plurality of source and drain diffusion regions to be coupled together to form the source and drain of multiple LDMOS transistors. Each diffusion ...


3
David G Daniels, Dale J Skelton, Ayesha I Mayhugh, David A Grant: System and method for dynamically regulating a step down power supply. Texas Instruments Incorporated, J Dennis Moore, W James Brady III, Frederick J Telecky Jr, June 1, 2004: US06744243 (45 worldwide citation)

A low gain feedback compensation circuit is provided on an integrated circuit. The feedback compensation circuit is coupled to a step down power supply on the integrated circuit. The step down power supply is operable to receive an input voltage and to generate an output voltage based on the input v ...


4
Dale J Skelton, Kuok Y Ling, Myron G Manternach: Analog control of inductive flyback voltages in a full bridge circuit. Texas Instruments Incorporated, Thomas G Eschweiler, Richard Donaldson, James C Kesterson, October 26, 1993: US05257175 (21 worldwide citation)

A voltage regulation circuit for use in "H" bridge circuit applications utilizes feedback networks to provide analog voltage regulation of the output nodes during switching of inductive loads. The regulation of the ouptut nodes during switching of inductive loads eliminates substrate current injecti ...


5
Taylor R Efland, Dave Cotton, Dale J Skelton: Method for LDMOS transistor with thick copper interconnect. Texas Instruments Incorporated, Dwight N Holmbo, Wade James Brady III, Frederick J Telecky Jr, April 16, 2002: US06372586 (21 worldwide citation)

A thick copper interconnection structure and method for an LDMOS transistor for power semiconductor devices. A large LDMOS transistor is formed of a plurality of source and drain diffusion regions to be coupled together to form the source and drain. Gate regions are formed between the alternating so ...


6
Taylor R Efland, Dale J Skelton: CMOS power device and method of construction and layout. Texas Instruments Incorporated, W James Brady III, Richard L Donaldson, April 28, 1998: US05744843 (19 worldwide citation)

CMOS power device (10) is provided. A tank region (62) is formed in a semiconductor substrate (60). A polysilicon gate layer (34) is disposed above the tank region (62) and defines a plurality of source and drain diffusion openings (38 and 36) having rounded inner corners (40). A plurality of backga ...


7
Dale J Skelton, Chao Chih Chiu, Taylor R Efland: Sensing of current in a synchronous-buck power stage. Texas Instruments Incorporated, W Daniel Swayze Jr, Wade James Brady III, Frederick J Telecky Jr, December 12, 2000: US06160388 (18 worldwide citation)

A DC-DC converter that generates a sense signal representing a voltage drop across a low-side switch when the low-side switch is on. The sense signal is inverted and stored in a "hold" capacitor until the beginning of the next switching cycle. More specifically, an input node receives an input volta ...


8
Taylor R Efland, David Cotton, Dale J Skelton: Method of making a multiple transistor integrated circuit with thick copper interconnect. Texas Instruments Incorporated, Mark E Courtney, W James Brady III, Richard L Donaldson, March 17, 1998: US05728594 (16 worldwide citation)

An interconnection structure and method for a multiple transistor integrated circuit power device is disclosed. A power integrated circuit is formed of a plurality of source and drain diffusion regions to be coupled together to form the source and drain of multiple LDMOS transistors. Each diffusion ...


9
Taylor R Efland, Dale J Skelton, Quang X Mai, Charles E Williams: Plastic encapsulation for integrated circuits having plated copper top surface level interconnect. Texas Instruments Incorporated, Mark E Courtney, Wade James Brady, Frederick J Telecky Jr, October 31, 2000: US06140702 (11 worldwide citation)

A plastic packaged integrated circuit (20) having a thick copper plated top surface level interconnection structure. A semiconductor integrated circuit (20) is formed having devices at the surface of a semiconductor substrate (23). First and second metallization layers (27, 31) are formed over the s ...


10
Dale J Skelton, Steven C Jones, Taylor R Efland, Lester L Hodson: Ripple regulator with improved initial accuracy and noise immunity. Texas Instruments Incorporated, Wade James Brady III, Frederick J Telecky Jr, November 14, 2000: US06147526 (11 worldwide citation)

A DC--DC converter having an input node receiving an input voltage V.sub.IN and generating an output voltage V.sub.OUT. A reference voltage generator provides a voltage V.sub.REF and a hysteresis voltage generator provides a voltage V.sub.HYST. A first comparator generates a signal determined from a ...



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