1
Brian S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, December 6, 1994: US05371654 (318 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


2
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 13, 1998: US05821763 (235 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


3
Brian S Beaman, Keith E Fogel, Paul A Lauro, Maurice H Norcott, Da Yuan Shih, George F Walker: Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer. International Business Machines Corporation, Daniel P Morris, June 3, 1997: US05635846 (218 worldwide citation)

A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard pack ...


4
Brain S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Method of forming a three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, July 2, 1996: US05531022 (212 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


5
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, January 1, 2002: US06334247 (170 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


6
Da Yuan Shih, Paul Lauro, Keith Edward Fogel, Brian Beaman, Maurice Norcott: Interconnector with contact pads having enhanced durability. International Business Machines Corporation, Daniel P Morris, September 22, 1998: US05810607 (167 worldwide citation)

A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type co ...


7
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice H Norcott, Da Yuan Shih, George Frederick Walker: Method of making high density integral test probe. International Business Machines Corporation, Daniel P Morris, December 25, 2001: US06332270 (164 worldwide citation)

A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having ...


8
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Angled flying lead wire bonding process. International Business Machines Corporation, Daniel P Morris, October 2, 2001: US06295729 (151 worldwide citation)

A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond ...


9
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: High density integrated circuit apparatus, test probe and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 9, 2001: US06300780 (149 worldwide citation)

A high density test probe for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packagi ...


10
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da Yuan Shih: Structures and processes to create a desired probetip contact geometry on a wafer test probe. International Business Machines Corporation, Daniel P Morris, March 27, 2001: US06206273 (144 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting wit ...