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Hong Zhou, Cuong Van Pham: Connector assembly for electrical interconnection. Visteon Global Technologies, Brinks Hofer Gilson & Lione, May 17, 2005: US06893300 (46 worldwide citation)

The present invention involves a universal connector assembly for electronic interconnection. The connector assembly includes a printed circuit board to which a male insert is in electrical communication. The male insert includes a strain relief tail connected to the printed circuit board and extend ...


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Robert Edward Belke Jr, Brian John Hayden, Cuong Van Pham, Rosa Lynda Nuno, Michael George Todd: Solderless flip-chip assembly and method and material for same. Visteon Global Technologies, Mark Mollon, December 4, 2001: US06326241 (22 worldwide citation)

A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical co ...


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Cuong Van Pham, Brian J Hayden, Bethany J Walles: Ultrasonic flip chip bonding process and apparatus. Ford Motor Company, Richard D Dixon, August 12, 1997: US05655700 (21 worldwide citation)

A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lo ...


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Andrew Z Glovatsky, Michael G Todd, Cuong Van Pham: Three-dimensional molded sockets for mechanical and electrical component attachment. Ford Motor Company, Leslie C Hodges, November 30, 1999: US05994648 (20 worldwide citation)

An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms ...


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Kenneth R Ulmer, Cuong Van Pham: Method and apparatus for use in assembling electronic devices. Intermedics, Schwegman Lundberg Woessner & Kluth P A, January 14, 2003: US06505665 (11 worldwide citation)

A first fixture holds a plurality of circuit components backside up in a substantially coplanar relationship. An adhesive applying device, such as screen printer, applies adhesive to the backside of each circuit component. A second fixture is aligned with and placed on the first fixture. The fixture ...


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Philip H Chen, Dennis M Gibson, Cuong Van Pham: Method and apparatus for use in assembling electronic devices. Intermedics, Schwegman Lundberg Woessner & Kluth P A, June 26, 2001: US06251219 (10 worldwide citation)

A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, s ...


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Alfred J Schaller, Cuong Van Pham: Heatspreader carrier strip. Ford Motor Company, Richard D Dixon, October 28, 1997: US05681663 (9 worldwide citation)

An intermediate workpiece includes a first strip of laminated material exhibiting high thermal conductivity and which is subject to bowing in response to thermal cycling. A second strip of copper material is welded to the first strip along a longitudinal abutting edge of each strip. The first strip ...


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Jay DeAvis Baker, Edward McLeskey, Delin Li, Cuong Van Pham, Robert Edward Belke, Vivek Amir Jairazbhoy, Thomas B Krautheim, Mohan R Paruchuri, Lakhi Nandlal Goenka, Jun Ming Hu: Method for making an electronic circuit assembly. Visteon Global Technologies, Steven L Oberholtzer, Brinks Hofer Gilson & Lione, May 7, 2002: US06381837 (8 worldwide citation)

A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations i ...


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Brian John Hayden, Cuong Van Pham, Rosa Lynda Nuno, Mark Stephen Topping: Method for ultrasonic bonding flexible circuits. Ford Motor Company, Leslie C Hodges, February 1, 2000: US06019271 (6 worldwide citation)

A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at ...