51
L Elliott Pflughaupt, David Gibson, Young Gon Kim, Craig S Mitchell: Stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 12, 2003: US20030107118-A1

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces whic ...


52
Thomas H DiStefano, Konstantine Karavakis, Craig S Mitchell, John W Smith: Compliant integrated circuit package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 6, 2003: US20030207499-A1

A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connecting the bond r ...


53
Zlata Kovac, Craig S Mitchell, Thomas H DiStefano, John W Smith: Methods of making microelectronic assemblies including compliant interfaces. Lerner David Littenberg Krumholz & Mentlik, February 6, 2003: US20030027374-A1

A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support struc ...


54
L Elliott Pflughaupt, David Gibson, Young Gon Kim, Craig S Mitchell, Wael Zohni, Ilyas Mohammed: Stacked packages. Tessera, Tessera, LERNER DAVID et al, February 16, 2006: US20060033216-A1

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces whic ...


55
L Elliott Pflughaupt, David Gibson, Young Gon Kim, Craig S Mitchell, Wael Zohni, Ilyas Mohammed: Microelectronic assembly having array including passive elements and interconnects. Tessera, Lerner David Litenberg Krumholz & Mentlik, August 11, 2005: US20050173796-A1

A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic element. One or more passive elements ...


56
Philip Damberg, Craig S Mitchell, John B Riley, Michael Warner: Low-height multi-component assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 13, 2003: US20030048624-A1

A microelectronic assembly has a first microelectronic element, a second microelectronic element, and a structure which projects downwardly from the second microelectronic element and at least partially encompassing the first microelectronic element. The structure is at least partially flexible. A m ...