1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525314 (56 worldwide citation)

A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the ...


2
Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 29, 2007: US07224056 (27 worldwide citation)

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...


3
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Michael Estrella, Jae M Park, Kenneth Robert Thompson, Craig S Mitchell, Belgacem Haba: Image sensor package and fabrication method. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 6, 2008: US07368695 (23 worldwide citation)

An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez Jr: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 20, 2010: US07759782 (20 worldwide citation)

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez Jr: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 6, 2011: US08071424 (18 worldwide citation)

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell: Microelectronic assemblies having very fine pitch stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 29, 2011: US08067267 (7 worldwide citation)

A method of making a stacked microelectronic assembly includes providing a first microelectronic package that includes a first substrate having a first dielectric layer, conductive posts, and conductive traces extending along the surface of the first dielectric layer; providing a second microelectro ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 19, 2009: US07534652 (6 worldwide citation)

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


8
Belgacem Haba Belgacem (Bel) Haba
Craig S Mitchell, Belgacem Haba: Micro lead frame packages and methods of manufacturing the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 18, 2007: US07309910 (1 worldwide citation)

A microelectronic package includes a microelectronic element having contacts, a dielectric element, at least a portion of the dielectric element extending beneath the microelectronic element, and a structure including portions of a lead frame. The structure includes a plurality of terminals and lead ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 10, 2013: US08531020

A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substra ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez Jr: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 1, 2014: US08686551

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.