1
Robert J Wojnarowski, Constantine A Neugebauer, Wolfgang Daum, Bernard Gorowitz, Eric J Wildi, Michael Gdula, Stanton E Weaver Jr, Anthony A Immorlica Jr: Wafer level integration and testing. Martin Marietta Corporation, Geoffrey H Krauss, Brian J Rees, November 22, 1994: US05366906 (94 worldwide citation)

In fabricating wafer scale integrated interconnects, a temporary or permanent dielectric layer and a pattern of electrical conductors are used to provide wafer scale integration or testing and burn-in. A resist can be used to cover the areas of IC pads on the wafer while the remainder of the pattern ...


2
Constantine A Neugebauer, James A Loughran: Method of fabricating gold bumps on ICs and power chips. General Electric Company, Robert Ochis, James C Davis Jr, Marvin Snyder, June 14, 1988: US04750666 (79 worldwide citation)

A method for depositing gold bumps on metallized pads of semiconductor chips uses a commercially available thermocompression or thermosonic gold wire bonder. The method includes the steps of depositing a gold ball with an attached wire on the metallized pad, and removing the wire so that a gold bump ...


3
Constantine A Neugebauer, Lionel M Levinson, Homer H Glascock II, Charles W Eichelberger, Robert J Wojnarowski, Richard O Carlson: Multi-chip interconnection package. General Electric Company, Marvin Snyder, James C Davis Jr, February 13, 1990: US04901136 (73 worldwide citation)

A package for interconnecting a plurality of integrated circuit chips into a functional unit comprising a multilayer substrate having ground and power conducting layers and a frame for holding the chips with their terminal pads on the side of the frame opposite the substrate. Power and ground termin ...


4
Constantine A Neugebauer: Hybrid integrated circuit chip package. General Electric Company, Robert Ochis, James C Davis Jr, Marvin Snyder, September 27, 1988: US04774632 (64 worldwide citation)

A hybrid integrated circuit chip package is disclosed which includes a hybrid, low loss, multilayer metallization, silicon printed wiring board as an interconnecting, two-sided module to reduce the length of interconnections between integrated circuit chips positioned on opposite sides of the module ...


5
Constantine A Neugebauer deceased, Robert J Wojnarowski: Hermetically sealed packaged electronic system. General Electric Company, Geoffrey H Krauss, August 9, 1994: US05336928 (61 worldwide citation)

A hermetically sealed electronic package particularly adapted for high density interconnect (HDI) electronic systems, employs a ceramic substrate as the package base. The substrate is provided with module contact pads. A barrier support frame on the module contact pads divides them into inner and ou ...


6
Guy L Babcock, Walter M Bryant, Constantine A Neugebauer, James F Burgess: Bonds between metal and a non-metallic substrate. General Electric Company, Geoffrey H Krauss, Joseph T Cohen, Jerome C Squillaro, November 23, 1976: US03993411 (59 worldwide citation)

A direct bond between metallic members and non-metallic members is achieved at elevated temperatures in a controlled reactive atmosphere without resorting to the use of electroless plating, vacuum deposition or intermediate metals. A metal member such as copper, for example, is placed in contact wit ...


7
Constantine A Neugebauer, Herbert S Cole, Eugene L Bartels, Raymond A Fillion: Moisture-proof electrical circuit high density interconnect module and method for making same. General Electric Company, Geoffrey H Krauss, Howard A Skaist, March 1, 1994: US05291066 (56 worldwide citation)

A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the ...


8
Constantine A Neugebauer deceased, Charles S Korman, David A Bates, William H Bicknell, Wolfgang Daum: High density interconnect multi-chip modules including embedded distributed power supply elements. General Electric Company, Brian J Rees, Geoffrey H Krauss, January 24, 1995: US05384691 (54 worldwide citation)

By employing High Density Interconnect (HDI) multi-chip modules (MCMs) having elements of a distributed power supply embedded in the MCM itself, the functions of an MCM and a power converter are combined. The embedded power supply elements include DC-DC or AC-DC converters to convert an input voltag ...


9
James F Burgess, Homer H Glascock II, Harold F Webster, Constantine A Neugebauer, James A Loughran: Multilayer circuit board fabricated from silicon. General Electric Company, Marvin Snyder, James C Davis Jr, February 7, 1989: US04803450 (45 worldwide citation)

Multilayer circuit boards composed primarily of silicon and containing buried ground planes and buried conducting runs are fabricated in one embodiment by positioning conductive patterns (12) on the surfaces of silicon substrates and melting a solder component of the conductive patterns (12) and all ...


10
Alexander J Yerman, Constantine A Neugebauer: Hermetic power chip packages. General Electric Company, Paul R Webb II, James C Davis Jr, February 24, 1987: US04646129 (41 worldwide citation)

Hermetic power chip packages are constructed in building block form to reduce the cost of electrical testing of power chips. The power chip packages utilized dielectric plates with metallic sheets bonded to the dielectric plates. Electric access to at least selected terminals of a power chip is gain ...