1
John M Rush, J Randolph Andrews, Richard Collins, Conor Patrick O Carroll, David Ou: Method and apparatus for prealigning wafers in a wafer sorting system. Fortrend Engineering Corporation, The Kline Law Firm, February 9, 1999: US05870488 (41 worldwide citation)

A wafer sorting system utilizing optical character recognition and optical "gate sensors" to determine the orientation of the wafers for prealigning. It is envisioned that the machine will be installed in conjunction with a computer controller and multiple cassette stations. A first end of a transfe ...


2
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, November 29, 2005: US06970644 (25 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


3
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, September 11, 2007: US07269343 (17 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


4
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, May 24, 2011: US07949237 (7 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


5
Zsolt Nenyei, Paul J Timans, Wilfried Lerch, J├╝ergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O Carroll, Rudy Cardema, Igor Fidelman, Sing Pin Tay, Yao Zhi Hu, Daniel J Devine: Method and system for thermally processing a plurality of wafer-shaped objects. Mattson Technology, Dority & Manning PA, July 12, 2011: US07977258 (4 worldwide citation)

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device fo ...


6
Conor Patrick O Carroll, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Zion Koren: Windows used in thermal processing chambers. Jason W Johnston Dority & Manning P A, July 4, 2002: US20020084424-A1

An apparatus for heat treating semiconductor wafers in a thermal processing chamber using light energy is provided. In one embodiment, the apparatus contains a window located between the semiconductor wafer and the energy source. The window contains a member that defines at least one passage capable ...


7
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardena, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Timothy A Cassidy, Dority & Manning Pa, January 29, 2004: US20040018008-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


8
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating Configuration for Use in Thermal Processing Chambers. Dority & Manning Pa, December 27, 2007: US20070297775-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


9
Zsolt Nenyei, Paul J Timans, Wilfried Lerch, Juergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O Carroll, Rudy Cardema, Igor Fidelman, Sing Pin Tay, Yao Zhi Hu, Daniel J Devine: Method and system for thermally processing a plurality of wafer-shaped objects. Dority & Manning Pa, October 9, 2008: US20080248657-A1

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device fo ...


10
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Dority & Manning Pa, September 29, 2005: US20050213949-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...