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Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, December 15, 2009: US07633765 (220 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...


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Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan: Multi-chip semiconductor package with integral shield and antenna. Amkor Technology, Tyco Electronics Logistics, Serge J Hodgson, Gunnison McKay & Hodgson L, February 3, 2004: US06686649 (153 worldwide citation)

A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a diel ...


3
Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan: Multi-chip semiconductor package with integral shield and antenna. Amkor Technology, Tyco Electronics Logistics, Gunnison McKay & Hodgson L, Serge J Hodgson, May 23, 2006: US07049682 (62 worldwide citation)

A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a diel ...


4
Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, September 13, 2011: US08018068 (30 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...


5
Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, McKay and Hodgson, Serge J Hodgson, July 24, 2012: US08227338 (13 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...