1
Warren Hayden, David K Uyemura, Richard E Burney, Christopher M Schreiber, Jacques F Linder: Three-dimensional integrated circuit stacking. Hughes Electronics, M W Sales, W K Denson Low, November 26, 1996: US05579207 (139 worldwide citation)

A plurality of integrated circuit chips (12) are packaged in a stack of chips in which a number of individual chip layers (10,120,130,132,134) are physically and electrically interconnected to one another and are peripherally sealed to one another to form an hermetically sealed package having a numb ...


2
Haim Feigenbaum, William R Crumly, Christopher M Schreiber: Electrical connections with shaped contacts. Hughes Aircraft Company, Elizabeth E Leitereg, T Gudmestad, W K Denson Low, October 11, 1994: US05354205 (85 worldwide citation)

Shaped contacts (40,42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16,18,26,28) makes indentations (24a,24b) of predetermined sh ...


3
Christopher M Schreiber, Haim Feigenbaum: Method for electrodepositing corrosion barrier on isolated circuitry. Hughes Aircraft Company, E E Leitereg, T Gudmestad, W K Denson Low, July 5, 1994: US05326412 (76 worldwide citation)

A corrosion resistant barrier is provided for isolated circuity. An isolated circuit (10, 12) with raised interconnection features (16, 18) having a corrosion resistant gold coating (34) is formed on a reusable stainless steel mandrel (22) which is provided with indentations to define raised feature ...


4
Christopher M Schreiber, Gerhard M Badasch: Flexible coaxial cable apparatus and method. Hughes Aircraft Company, Joseph E Szabo, Anthony W Karambelas, July 4, 1989: US04845311 (61 worldwide citation)

A flexible coaxial cable capable of high frequency signal propagation formed from a multilayer configuration having a plurality of adjacent signal traces etched in dielectric material and surrounded by a protective ground layer. Selected ones of the signal traces are designated to be conducting sign ...


5
Haim Feigenbaum, William R Crumly, Christopher M Schreiber: Method for making 3-D electrical circuitry. Hughes Aircraft Company, Elizabeth E Leitereg, Terje Gudmestad, W K Denson Low, May 3, 1994: US05307561 (31 worldwide citation)

Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermin ...


6
Christopher M Schreiber, William R Crumly: Resilient interconnection bridge. Hughes Aircraft Company, Jeannette M Walder, Terje Gudmestad, Wanda K Denson Low, January 19, 1993: US05180311 (31 worldwide citation)

An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided ...


7
Christopher M Schreiber: Method of forming an interconnection by an excimer laser. Hughes Aircraft Company, Joseph E Szabo, Terje Gudmestad, Wanda K Denson Low, October 9, 1990: US04961259 (28 worldwide citation)

A raised metal connection feature (29) is created by forming a conductive pad (17) on a flexible substrate (11) and applying a flexible dielectric insulator (19) and photoresist layer (21) over the conductive pad (17). An excimer laser (25) is used to ablate a via (27) through the dielectric insulat ...


8
William R Crumly, Christopher M Schreiber, David B Swarbrick: Semi-additive circuitry with raised features using formed mandrels. Hughes Aircraft Company, Terje Gudmestad, Wanda K Denson Low, May 4, 1993: US05207887 (28 worldwide citation)

A circuit is produced by using a formed mandrel (10,12) and semi-additive techniques for creating circuit traces. A stainless steel mandrel (10) flash plated with copper (14) includes a depression (12) which will form a raised interconnection feature (24). Using a photolithographically formed patter ...


9
Christopher M Schreiber, William R Crumly: Stackable high density interconnection mechanism (SHIM). Hughes Aircraft Company, Elizabeth E Leitereg, Terje Gudmestad, Wanda K Denson Low, September 14, 1993: US05245135 (27 worldwide citation)

A high density of interconnection sites on a dielectric substrate is provided by producing a laminated assembly with multiple layers of conductors (11, 21) positioned one above the other within the substrate (8). Each conductor (11, 21) terminates at a raised feature (12, 22) projecting beyond the s ...


10
William R Crumly, Christopher M Schreiber, Haim Feigenbaum: Method of forming three-dimensional circuitry. Hughes Aircraft Company, Terje Gudmestad, Wanda K Denson Low, March 30, 1993: US05197184 (26 worldwide citation)

A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, ...