1
Jens Pohl, Bernd Roemer, Bernhard Schaetzler, Christian Stuempfl, Herman Vilsmeier, Holger Woerner, Bernhard Zuhr: Semiconductor module with a semiconductor stack, and methods for its production. Infineon Technologies, Edell Shapiro & Finnan, November 25, 2008: US07456495 (33 worldwide citation)

An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor compo ...


2
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic package and method for production. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276783 (26 worldwide citation)

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


3
Bernd Goller, Robert Christian Hagen, Christian Stuempfl, Stefan Wein, Holger Woerner: Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, June 7, 2005: US06902951 (17 worldwide citation)

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semi ...


4
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Universal package for an electronic component with a semiconductor chip and method for producing the universal package. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Gregory L Mayback, March 15, 2005: US06867471 (15 worldwide citation)

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of ...


5
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, April 14, 2009: US07517722 (10 worldwide citation)

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper ...


6
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Christian Stuempfl, Horst Theuss, Hermann Vilsmeier: Semiconductor device having through contacts through a plastic housing composition and method for the production thereof. Infineon Technologies, Dicke Billig & Czaja PLLC, May 17, 2011: US07944061 (4 worldwide citation)

The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring ...


7
Michael Bauer, Markus Brunnbauer, Irmgard Escher Poeppel, Jens Pohl, Christian Stuempfl: Electronic structure with components connected by way of solderable connecting elements and method. Infineon Technologies, Dicke Billig & Czaja PLLC, February 23, 2010: US07666777 (4 worldwide citation)

For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electr ...


8
Michael Bauer, Ludwig Heitzer, Christian Stuempfl: Electronic circuit in a package-in-package configuration and production method. Infineon Technologies, Dicke Billig & Czaja PLLC, May 11, 2010: US07714416 (2 worldwide citation)

An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an encapsulation and composed of at least one semiconductor element on an element carrier, at least one leadframe with at least one inner contact-conn ...


9
Michael Bauer, Ludwig Heitzer, Christian Stuempfl: Electronic component of VQFN design and method for producing the same. Infineon Technologies, Edell Shapiro & Finnan, December 11, 2012: US08330260 (1 worldwide citation)

A method for producing an electronic component of a VQFN (very thin quad flat pack no-lead) design includes the following method steps: anchoring at least one integrated circuit element on a sacrificial substrate; contact-connecting the at least one integrated circuit element to the sacrificial subs ...


10
Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl: Method for coating a structure comprising semiconductor chips. Infineon Technologies, Edell Shapiro & Finnan, June 16, 2009: US07547645 (1 worldwide citation)

A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particl ...