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Chiu Ting H, Holtkamp William H, Ko Wen C, Lowery Kenneth J, Cho Peter: Process chamber and method for depositing and/or removing material on a substrate. Cutek Research, June 25, 2001: KR1020007001828

A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved verticall ...


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