1
Chiu Ting, Valery Dubin: Plated copper interconnect structure. Advanced Micro Devices, October 19, 1999: US05969422 (415 worldwide citation)

A high conductivity interconnect structure is formed by electroplating or electroless plating of Cu or a Cu-base alloy on a seed layer comprising an alloy of a catalytically active metal, such as Cu, and a refractory metal, such as Ta. The seed layer also functions as a barrier/adhesion layer for th ...


2
Valery Dubin, Chiu Ting: Method for fabricating copper-aluminum metallization. Advanced Micro Devices, Edward C Kwok, Skjerven Morrill MacPherson Franklin & Friel, June 15, 1999: US05913147 (245 worldwide citation)

A method for fabricating copper-aluminum metallization utilizing the technique of electroless copper deposition is described. The method provides a self-encapsulated copper-aluminum metallization structure.


3
Valery Dubin, Chiu Ting, Robin W Cheung: Pulse electroplating copper or copper alloys. Advanced Micro Devices, October 26, 1999: US05972192 (173 worldwide citation)

High aspect ratio openings in excess of 3, such as trenches, via holes or contact holes, in a dielectric layer are voidlessly filled employing a pulse or forward-reverse pulse electroplating technique to deposit copper or a copper-base alloy. A leveling agent is incorporated in the electroplating co ...


4
Valery Dubin, Chiu Ting: Copper-aluminum metallization. Advanced Micro Devices, Edward C Kwok Esq, Skjerven Morrill MacPherson, August 7, 2001: US06271591 (35 worldwide citation)

A method for fabricating copper-aluminum metallization utilizing the technique of electroless copper deposition is described. The method provides a self-encapsulated copper-aluminum metallization structure.


5
Artur Kolics, Nicolai Petrov, Chiu Ting, Igor Ivanov: Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper. Blue29, Mollie E Lettang, Daffer McDaniel, June 7, 2005: US06902605 (26 worldwide citation)

The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical characteristics, when the Co—Cu syst ...


6
Artur Kolics, Nicolai Petrov, Chiu Ting, Igor C Ivanov: Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation. Blue29 Corporation, Mollie F Lettang, Conley Rose P C, September 21, 2004: US06794288 (23 worldwide citation)

The method for selective deposition of Co—W—P system films onto copper with palladium-free activation consists of creating hydrogen-rich complexes on the metal surface prior to deposition. More specifically, the method consists of creating the aforementioned complexes on the copper surfaces prior to ...


7
Artur Kolics, Nicolai Petrov, Chiu Ting, Igor C Ivanov: Solution composition and method for electroless deposition of coatings free of alkali metals. Blue29, Mollie E Lettang, Daffer McDaniel, June 28, 2005: US06911067 (13 worldwide citation)

An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing agent, which reduces the first-meta ...


8
Chiu Ting Lin: Collapsible table. Gain Ping, November 8, 2011: US08051785 (8 worldwide citation)

A collapsible table includes a table board, at least one folding mechanism, and plural table legs. The folding mechanism further includes a central body, at least one rotation lock assembly, and a pair of fastening assemblies mounted on the table legs. The central body is settled between the two fas ...


9
Alexander Gyure, Jindrich Zejda, Peivand Fallah Tehrani, Wenyuan Wang, Chi Chong Lo, Mahmoud Shahram, Yansheng Luo, William Chiu Ting Shu, Seyed Alireza Kasnavi: Method and apparatus for characterizing the propagation of noise through a cell in an integrated circuit. Synopsys, Park Vaughan & Fleming, February 28, 2006: US07007252 (6 worldwide citation)

One embodiment of the invention provides a system that characterizes cells within an integrated circuit. During operation, the system obtains a number of input noise signals to be applied to the cell. The system then simulates responses of the cell to each of the input noise signals, and stores a re ...


10
Igor Ivanov, Chiu Ting, Jonathan Weiguo Zhang, Arthur Kolics: Spatially-arranged chemical processing station. Blue29, Mollie E Lettang, Daffer McDaniel, September 6, 2005: US06939403 (6 worldwide citation)

The present invention discloses a station, e.g., for IC fabrication with a flexible configuration. It consists of an array of processing chambers, which are grouped into processing modules and arranged in a two-dimensional fashion, in vertical levels and horizontal rows, and is capable of operating ...