1
Jung Po Chen, Ming Fang Hsu, An Tse Lee, Chung Ta Cheng, Chin Tien Yang, Sheng Li Chang, Kuo Chi Chiu: Inorganic resist material and nano-fabrication method by utilizing the same. Industrial Technology Research Institute, J C Patents, December 16, 2008: US07465530 (4 worldwide citation)

An inorganic resist material is provided, which is an incomplete oxide of a phase-change material. The oxygen content in the inorganic resist material is lower than the stoichiometric oxygen content of a complete oxide of the phase-change material, and a general formula of the inorganic resist mater ...


2
Sheng Yung Liu, Chin Tien Yang, Chun Hung Lin: Solar cell with two exposed surfaces of ARC layer disposed at different levels. Big Sun Energy Technology, Muncy Geissler Olds & Lowe PLLC, August 28, 2012: US08253010 (3 worldwide citation)

A solar cell includes a substrate, a conductor layer and an anti-reflection coating (ARC) layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The conductor layer has a first portion embedded into the doped region and a second portion other than the first ...


3
Chia Hung Lai, Jiunn Jyi Lin, Tzong Sheng Chang, Min Cao, Huan Chi Tseng, Yu Hua Lee, Chin Tien Yang: Bond pad scheme for Cu process. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, March 21, 2006: US07015129 (3 worldwide citation)

A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subseq ...


4
Wen Yuh Jywe, Jing Chung Shen, Chin Tien Yang, Chien Hung Liu, Jau Jiu Ju, Chia Hung Wu, Chun Chieh Huang, Lili Duan, Yuan Chin Lee: Manufacturing-process equipment. National Formosa University, C G Mersereau, Nikolai & Mersereau P A, November 5, 2013: US08575791 (2 worldwide citation)

A manufacturing-process equipment has a platform assembly, a measurement feedback assembly and a laser-working assembly. The platform assembly has a base and a hybrid-moving platform. The base has a mounting frame. The hybrid-moving platform is mounted on the base and has a long-stroke moving stage ...


5
Chin Tien Yang, Ming Fang Hsu, Sheng Li Chang, Tzuan Ren Jeng: Laser patterning method for fabricating disc stamper. Industrial Technology Research Institute, Jianq Chyun IP Office, June 22, 2010: US07741006 (2 worldwide citation)

A method for fabricating a disc stamper is provided. First, a substrate is provided. Next, a layer of a coatable inorganic material is coated on the substrate, wherein the coatable inorganic material is an oxide, in which the chemical element constitution is more than one element selected from the g ...


6
Chin Tien Yang, Juan Jann Jou, Yu Hua Lee, Chia Hung Lai: Method for manufacturing dual damascene structure with a trench formed first. Taiwan Semiconductor Manufacturing, Hoffman Wasson & Gitler, June 6, 2006: US07056821 (2 worldwide citation)

A method for manufacturing a dual damascene structure, which forms a trench first, is described. The manufacturing method has following steps. First, a substrate with a plurality of semiconductor devices is provided. A first metal layer, a first etching stop layer, a dielectric layer, and a second e ...


7
Chia Hung Lai, Jiunn Jyi Lin, Tzong Sheng Chang, Min Cao, Huan Chi Tseng, Yu Hua Lee, Chin Tien Yang: Bond pad scheme for Cu process. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, January 18, 2005: US06844626 (2 worldwide citation)

A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subseq ...


8
Chia Tai Chang, Chin Yi Tsai, Chiu Kuei Chen, Chen Chih Yu, Chien Chang Lai, Chin Tien Yang, Hui Pin Yang, Keng Shieng Chang, Yun Ru Huang: High frequency probe card. MPI CORPORATION, Muncy Geissler Olds & Lowe P C, December 1, 2015: US09201098 (1 worldwide citation)

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and hav ...


9
Chin Tien Yang, Chung Hsi Chia: Method of videophone data transmission. Leadtek Research, Connolly Bove Lodge & Hutz, Larry J Hume, October 3, 2006: US07116349 (1 worldwide citation)

A method of videophone data transmission based on the PKI (Public Key Infrastructure) is executed with a videophone and a user. The method includes the steps of performing a connection procedure, performing a data download procedure and performing a disconnection procedure. While performing the conn ...


10
Chin Tien Yang, Ming Fang Hsu, Sheng Li Chang, Tzuan Ren Jeng: Method of forming pattern by utilizing coatable inorganic material. Industrial Technology Research Institute, Jianq Chyun IP Office, June 22, 2010: US07741004 (1 worldwide citation)

A coatable inorganic material is provided, which is suitable for being coated on a substrate in the form of sol-gel solution and then being directly written with thermochemical mode by using a laser beam. The coatable inorganic material is an oxide, in which the chemical element constitution is more ...