1
Po Tao Chu, Ching Wen Cho, Chia Hung Lai, Chih Chien Hung: Method of stripping photoresist from Al bonding pads that prevents corrosion. Taiwan Semiconductor Manufacturing Company, George O Saile, Stephen B Ackerman, William J Stoffel, December 28, 1999: US06006764 (32 worldwide citation)

The present invention provides a method of removing photoresist from a wafer surface having a bonding pad using a three step clean composed of (1) a wet cleaning the substrate, (2) a F-containing gas high temperature plasma treatment which prevents the corrosion of aluminum contact pad, and (3) comp ...


2
Chia Hung Lai: Transparent shell structure for luggage and the like. Chia Hung Lai, Meng Chun Lai Chu, Chen Yuch Hsu, Muncy Geissler Olds & Lowe P C, June 30, 2015: US09066566 (3 worldwide citation)

A transparent shell structure for luggage and the like includes an outer shell, a decorative plate, a lining, and a plurality of corner protectors. The outer shell has an inner space with a frame. One side of the decorative plate is a patterned surface. Each of the four corners of the decorative pla ...


3
Chia Hung Lai, Jiunn Jyi Lin, Tzong Sheng Chang, Min Cao, Huan Chi Tseng, Yu Hua Lee, Chin Tien Yang: Bond pad scheme for Cu process. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, March 21, 2006: US07015129 (3 worldwide citation)

A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subseq ...


4
Yen Ming Chen, Huan Chi Tseng, Yu Hua Lee, Dian Hau Chen, Chia Hung Lai, Kang Min Kuo: Laminated silicate glass layer etch stop method for fabricating microelectronic product. Taiwan Semiconductor Manufacturing, Tung & Associates, January 9, 2007: US07160811 (2 worldwide citation)

A method for fabricating a microelectronic fabrication employs an undoped silicate glass layer as an etch stop layer when etching a doped silicate glass layer with an anhydrous hydrofluoric acid etchant. The method is particularly useful for forming a patterned salicide blocking dielectric layer whe ...


5
Chin Tien Yang, Juan Jann Jou, Yu Hua Lee, Chia Hung Lai: Method for manufacturing dual damascene structure with a trench formed first. Taiwan Semiconductor Manufacturing, Hoffman Wasson & Gitler, June 6, 2006: US07056821 (2 worldwide citation)

A method for manufacturing a dual damascene structure, which forms a trench first, is described. The manufacturing method has following steps. First, a substrate with a plurality of semiconductor devices is provided. A first metal layer, a first etching stop layer, a dielectric layer, and a second e ...


6
Chia Hung Lai, Jiunn Jyi Lin, Tzong Sheng Chang, Min Cao, Huan Chi Tseng, Yu Hua Lee, Chin Tien Yang: Bond pad scheme for Cu process. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, January 18, 2005: US06844626 (2 worldwide citation)

A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subseq ...


7
Yueh Min Huang, Chia Ju Liu, Chia Hung Lai, Yen Ning Su, Chia Cheng Hsu, Yu Cheng Chien, Tsung Ho Liang, Tzu Chien Liu, Fu Yun Yu, Yu Lin Jeng: Method and system for reminding reader of fatigue in reading while using electronic device. National Cheng Kung University, Rosenberg Klein & Lee, February 23, 2016: US09269257

The method and system for reminding readers of fatigue in reading while using electronic devices are revealed. First use a reading speed calculation module to detect user's reading speed within a period of time when the user is using an electronic with a display to read. The reading speed is related ...


8
Chia Hung Lai: Distance adjustment system for use in solar wafer inspection machine and inspection machine provided with same. Chroma Ate, June 11, 2013: US08461857

The present invention relates to a distance adjustment system and a solar wafer inspection machine provided with the system. The inspection machine has a conveyer for carrying a solar wafer, an optical inspection system for inspecting the surface and color appearance of the wafer and an illumination ...


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Chia Hung Lai, Jiunn Jyi Lin, Tzong Sheng Chang, Min Cao, Huan Chi Tseng, Yu Hua Lee, Chin Tien Yang: Bond pad scheme for cu process. Slater & Matsil, November 25, 2004: US20040235223-A1

A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subseq ...