1
Yi Chuan Ding, Chia Ching Chen: Semiconductor device packages including connecting elements. Advanced Semiconductor Engineering, Foley & Lardner, October 2, 2012: US08278746 (72 worldwide citation)

Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one embodiment, a semiconductor device package includes a set of connecting elements disposed adjacent to a periphery of a set of stacked semiconductor de ...


2
Yi Chuan Ding, Chia Ching Chen: Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof. Advanced Semiconductor Engineering, Foley & Lardner, Cliff Z Liu, Angela D Murch, January 7, 2014: US08624374 (31 worldwide citation)

An embodiment of a semiconductor device package includes: (1) an interconnection unit including a patterned conductive layer; (2) an electrical interconnect extending substantially vertically from the conductive layer; (3) a semiconductor device adjacent to the interconnection unit and electrically ...


3
Chia Ching Chen: Two-step and toothless bicycle head shaft bowl set. Larson and Taylor, July 15, 1997: US05647684 (18 worldwide citation)

A fastening device is capable of holding securely the head tube and the handlebar sleeve in the front fork of a bicycle. The front fork is provided respectively at both upper end thereof and lower end thereof with a restraining ring which is of an arcuate construction and is capable of bringing abou ...


4
Chia Ching Chen, Yi Chuan Ding: Semiconductor package including a stacking element. Advanced Semiconductor Engineering, Foley & Lardner, March 26, 2013: US08405213 (12 worldwide citation)

A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, ...


5
Chia Ching Chen: Two-step and toothless bicycle head shaft bowl set. Larson and Taylor, July 16, 1996: US05536104 (12 worldwide citation)

A two-step and toothless bicycle head shaft bowl set has a two-step locking device making use of two semi-cylindrical members and an upper cover provided with a fastening bolt. The two semi-cylindrical members can be caused to effect the fastening by tightening the fastening bolt of the upper cover. ...


6
Chia Ching Chen: Support frame of sheet product. Browdy and Neimark PLLC, March 19, 2002: US06357195 (4 worldwide citation)

A support frame is intended to support the decorative sheet product and is formed of a plurality of longitudinal elements and horizontal elements, which are in turn formed of a plurality of base portions and main bodies. The base portions are provided with a protrusion and a recess opposite in locat ...


7
Chia Ching Chen: Pedal shaft core. Larson and Taylor, May 4, 1993: US05207118 (3 worldwide citation)

An improved pedal shaft core is characterized in that the contact surfaces of both shaft core and shaft bearing are designed to be oblique and conical to enable the bearing to comprise roller nest bearing and a casing of circular and conical arc so as to enhance the rotational stability of the pedal ...


8
Chia Ching Chen: Fastening device of bicycle pedal axle. Larson and Taylor, July 18, 1995: US05433534 (2 worldwide citation)

A fastening device of bicycle pedal axle comprises an outer sleeve, a locating sleeve, and a fastening ring. The pedal axle is held securely by the outer sleeve and the locating sleeve, which are in turn fastened securely together by the fastening ring having a plurality of retaining projections whi ...


9
Chia Ching Chen, Yi Chuan Ding: Stackable semiconductor package and manufacturing method thereof. Advanced Semiconductor Engineering, Foley & Lardner, Cliff Z Liu, Angela D Murch, May 24, 2016: US09349611 (1 worldwide citation)

A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, ...


10
Guo Cheng Liao, Chia Ching Chen, Yi Chuan Ding: Semiconductor substrate and semiconductor package structure having the same. ADVANCED SEMINCONDUCTOR ENGINEERING, Foley & Lardner, Cliff Z Liu, Angela D Murch, September 6, 2016: US09437565 (1 worldwide citation)

The present disclosure relates to a semiconductor package structure including a semiconductor substrate, a semiconductor chip and a conductive material. The semiconductor substrate includes an insulating layer, a conductive circuit layer and a conductive bump. The conductive circuit layer is recesse ...