1
Chi J Song, Gi B Cha: Semiconductor package and method for manufacturing the same. Goldstar Electron, Lowe Price LeBlanc & Becker, August 22, 1995: US05444301 (231 worldwide citation)

A plastic semiconductor package and a method for producing the same. The package comprises a plurality of chip signal transmitting leads protruded from a semiconductor chip and functioning as electrical passage, a plurality of polyimide tapes each attached to the corresponding lead and having the sa ...


2
Chi J Song: Lead frame and semiconductor package with such lead frame. Goldstar Electron, Lowe Price LeBlanc & Becker, September 10, 1996: US05554886 (55 worldwide citation)

A lead frame and a semiconductor package produced using the lead frame are disclosed. The lead frame has a plurality of multi-layered inner leads, each of the multi-layered inner leads having at least two different metal layers joined to each other. An outer lead is formed by an extension part of at ...


3
Chi J Song: Semiconductor package and method for manufacturing the same. Goldstar Electron, Lowe Price LeBlanc & Becker, November 28, 1995: US05471088 (22 worldwide citation)

A semiconductor package having lead bars provided with upper and lower surfaces outwardly exposed, thereby enabling a stacked mounting, a memory extension and a reduction in mounting area.