1
Cheng Yin Lee, Loa Andersson: System and method for loop avoidance in multi-protocol label switching. Nortel Networks, Katten Muchin Zavis Rosenman, April 12, 2005: US06879594 (122 worldwide citation)

A method for avoiding loops from forming when setting up label switched paths is provided. The method uses a Label Splicing Message is followed by an Acknowledgment message to determine if loops are formed in the process of joining a new node or subtree to a multicast MPLS tree. By verifying that th ...


2
Yen Yi Wu, Wei Yueh Sung, Pao Huei Chang Chien, Chi Chih Chu, Cheng Yin Lee, Gwo Liang Weng: Method of making a semiconductor package and method of making a semiconductor device. Advanced Semiconductor Engineering, Cooley Godward Kronish, January 5, 2010: US07642133 (104 worldwide citation)

The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electri ...


3
Gwo Liang Weng, Shih Chang Lee, Cheng Yin Lee: Chip package structure and manufacturing method thereof. Advanced Semiconductor Engineering, Jianq Chyun IP Office, June 13, 2006: US07061079 (97 worldwide citation)

The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package structure with a higher integration. The chip package structure comprises a carrier, at least a chip, a h ...


4
Cheng Yin Lee, Loa Andersson: Method for engineering paths for multicast traffic. Nortel Networks, April 27, 2004: US06728777 (95 worldwide citation)

A method to engineer paths for multicast traffic in an IP network, by directing the control messages to setup multicast trees on engineered paths, is disclosed. The multicast traffic engineering process is separated from the multicast route setup and the resources and the paths for multicast data de ...


5
Cheng Yin Lee, Fayaz Kadri, Glenn Morrow: Method and program code for communicating with a mobile node through tunnels. Nortel Networks, Steubing McGuinness & Manaras, July 5, 2005: US06915325 (50 worldwide citation)

Location update messages for a mobile node can be made interceptible by routers which form tunnels for communication with the mobile node. A correspondent agent intercepts a Binding Update with a Router Alert and binds the address of the mobile node with a care of address for the mobile node provide ...


6
Gwo Liang Weng, Yung Li Lu, Cheng Yin Lee: Stackable semiconductor package. Advanced Semiconductor Engineering, Volentine & Whitt P L L C, September 15, 2009: US07589408 (30 worldwide citation)

A stackable semiconductor package includes first and second substrates, a semiconductor device, first wires, a supporting element, and a first molding compound. The semiconductor device is disposed on the first substrate. The second substrate is disposed above the semiconductor device, and the area ...


7
Cheng Yin Lee: Mechanism for splicing trees. Nortel Networks, September 28, 2004: US06798739 (23 worldwide citation)

A method for detecting a routing loop when repairing a bidirectional multicast distribution tree is disclosed. According to the method, a splice message is launched from an originating node attempting to join a bidirectional multicast tree and is sent to a root-node to find out if a routing loop is ...


8
Cheng Yin Lee: Hybrid virtual private LAN extensions. Alcatel Lucent, Kramer & Amado P C, November 17, 2009: US07619966 (18 worldwide citation)

This invention is applicable to a Virtual Private LAN service built using multiple point-to-point Ethernet services from a network operator, where the bridging and the transport/tunneling of Ethernet frames to a remote site are decoupled. The learning bridge function (including MAC address learning ...


9
Chia Fu Wu, Cheng Yin Lee: Semiconductor package and manufacturing method thereof. Advanced Semiconductor Engineering, J C Patents, May 18, 2010: US07719094 (17 worldwide citation)

A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part i ...


10
Meng Jung Chuang, Cheng Yin Lee, Wei Chang Tai, Chi Chih Chu: System-in-package structure. Advanced Semiconductor Engineering, Winston Hsu, August 26, 2008: US07417329 (16 worldwide citation)

A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the p ...