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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Ireland, Lerner David Littenberg Krumholz & Mentlik, May 3, 2011: US07935568 (44 worldwide citation)

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


2
Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 7, 2010: US07791199 (36 worldwide citation)

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


3
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 8, 2011: US08053281 (1 worldwide citation)

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


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Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 22, 2014: US08704347

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


5
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, May 1, 2008: US20080099900-A1

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


6
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Tessera, LERNER DAVID et al, June 25, 2009: US20090162975-A1

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


7
Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Tessera, LERNER DAVID et al, January 20, 2011: US20110012259-A1

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


8
Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Tessera, LERNER DAVID et al, May 22, 2008: US20080116545-A1

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


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Vage Oganesian, Andrey Grinman, Charles Rosenstein, Felix Hazanovich, David Ovrutsky, Avi Dayan, Yulia Aksenton, Ilya Hecht: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, October 5, 2010: US07807508 (35 worldwide citation)

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at at least one of the front and ...


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Giles Humpston, Michael J Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian, Robert Burtzlaff, Avi Dayan, Andrey Grinman, Felix Hazanovich, Ilya Hecht, Charles Rosenstein, David Ovrutsky, Mitchell Hayes Reifel: Wafer level chip packaging. Tessera Technologies Ireland, Lerner David Littenberg Krumholz & Mentlik, May 3, 2011: US07936062 (31 worldwide citation)

Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least o ...