1
Charles H Perry, Tibor L Bauer, David C Long, Bruce C Pickering, Pierre C Vittori: Interface card for a probe card assembly. International Business Machines Corporation, Ira D Blecker, May 13, 1997: US05629631 (83 worldwide citation)

Disclosed is a probe card assembly which includes an interface card having a plurality of contact pads on at least one surface thereof, a probe card having a plurality of contact pads on at least one surface thereof, and a carousel interposed between the interface card and the probe card having a pl ...


2
James M Leas, Robert W Koss, George F Walker, Charles H Perry, Jody J Van Horn: Semiconductor wafer test and burn-in. International Business Machines Corporation, Richard Kotulak, February 4, 1997: US05600257 (77 worldwide citation)

An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chi ...


3
Daniel George Berger, Shaji Farooq, Lester Wynn Herron, James N Humenik, John Ulrich Knickerbocker, Robert William Pasco, Charles H Perry, Krishna G Sachdev: Polymer and ceramic composite electronic substrates. International Business Machines Corporation, Ira D Blecker, March 4, 2003: US06528145 (71 worldwide citation)

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material ...


4
Charles H Perry, Tibor L Bauer, David C Long, Bruce C Pickering, Pierre C Vittori: Probe card assembly. International Business Machines Corporation, Ira David Blecker, June 25, 1996: US05530371 (67 worldwide citation)

A carousel for a probe card assembly which includes opposed planar rings supported and spaced apart by flexible supports. The flexible supports, while supporting the planar rings, also allow the planar rings to rotate with respect to each other. Also included are a plurality of connecting means whic ...


5
Abbas Behfar Rad, Charles H Perry, Krishna G Sachdev: Ceramic probe card and method for reducing leakage current. International Business Machines Corporation, Peter W Delio & Peterson Peterson, Steven J Soucar, July 2, 1996: US05532608 (65 worldwide citation)

An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 ...


6
Charles H Perry, Tibor L Bauer, David C Long, Bruce C Pickering, Pierre C Vittori: Probe card assembly having a ceramic probe card. International Business Machines Corporation, Ira D Blecker, August 13, 1996: US05546012 (63 worldwide citation)

Disclosed is a probe card assembly which includes an interface card having a plurality of contact pads on at least one surface thereof, a probe card having a plurality of contact pads on at least one surface thereof, and a carousel interposed between the interface card and the probe card having a pl ...


7
Thomas W Bachelder, Dennis R Barringer, Dennis R Conti, James M Crafts, David L Gardell, Paul M Gaschke, Mark R Laforce, Charles H Perry, Roger R Schmidt, Joseph J Van Horn, Wade H White: Segmented architecture for wafer test and burn-in. International Business Machines Corporation, William N Hogg, Robert A Walsh, August 14, 2001: US06275051 (60 worldwide citation)

An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distribut ...


8
Philip L Flaitz, Arlyne M Flanagan, Joseph M Harvilchuck, Lester W Herron, John U Knickerbocker, Robert W Nufer, Charles H Perry, Srinivasa N Reddy, Steven P Young: Method and means for co-sintering ceramic/metal MLC substrates. International Business Machines Corporation, Ira David Blecker, July 14, 1992: US05130067 (47 worldwide citation)

A method for co-sintering ceramic/metal multi-layered ceramic substrates wherein X-Y shrinkage is controlled and X-Y distortion and Z-direction chamber are substantially eliminated. Binder-burnoff is substantially not aggravated during this process as well. The process is accomplished by applying se ...


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Yuet Ying Yu, Daniel G Berger, Camille Proietti Bowne, Scott Langenthal, Charles H Perry, Terence Spoor, Thomas Weiss: Self-scrub buckling beam probe. International Business Machines Corporation, H Daniel Schnurmann, March 4, 2003: US06529021 (26 worldwide citation)

A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with ...