1
Carmine G Meola: Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom. W L Gore & Associates, Gary A Samuels, March 12, 1996: US05498467 (34 worldwide citation)

There is provided a process for producing conductive areas through selected portions of the Z axis of a porous planar material. In the process, the planar material is sensitized to the reception of electroless metal with an electroless metal deposition solution. The planar material is provided throu ...


2
Bradley D Knott, Carmine G Meola, David L Murray, Mark Stephen Spencer: Reusable, selectively conductive, Z-axis, elastomeric composite substrate. W L Gore & Associates, Victor M Genco Jr, March 24, 1998: US05731073 (18 worldwide citation)

The invention relates to an open cell, porous, selectively conductive member containing an elastomer that is reusable in use and preparation. The scaffold for the elastomer has conductive areas through conductive, z-axis pathways are provided which are electrically isolated from adjacent z-axis cond ...


3
Thomas Clupper, Carmine G Meola, Bradley E Reis: EMI/RFI shielding gasket. Gore Enterprise Holdings, Allan M Wheatcraft, October 30, 2001: US06309742 (17 worldwide citation)

AN EMI/RFI gasket with an open-celled foam substrate having a metal coating on its skeletal structure that is substantially deformable and recoverable. The gasket provides shielding effectiveness of greater than 40 dB.


4
Bradley D Knott, Carmine G Meola, David L Murray, Mark Stephen Spencer: Reusable, selectively conductive, z-axis elastomeric composite substrate. Gore Enterprise Holdings, Victor M Genco Jr, March 23, 1999: US05886413 (5 worldwide citation)

The invention relates to an open cell, porous, selectively conductive member containing an elastomer that is reusable in use and preparation. The scaffold for the elastomer has conductive areas through conductive, z-axis pathways are provided which are electrically isolated from adjacent z-axis cond ...


5
Carmine G Meola, Daniel D Johnson, Donald R Banks, Joseph G Ameen: Metallurgical interconnect composite. W L Gore & Associates, Victor M Genco Jr, June 8, 1999: US05910354 (2 worldwide citation)

A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.