1
Carmen D Burns: Ultra high density integrated circuit packages method. Staktek Corporation, Fulbright & Jaworski, January 18, 1994: US05279029 (305 worldwide citation)

An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality o ...


2
Carmen D Burns: Lead-on-chip integrated circuit fabrication method. Staktek Corporation, Fulbright & Jaworski, June 22, 1993: US05221642 (244 worldwide citation)

A method and apparatus for achieving lead-on-chip integrated circuit packages by transferring at least one extremely thin adhesive from a carrier onto the face of integrated circuit chips, laminating a lead frame to the last adhesive layer, curing the adhesive to act as an insulator, bonding to the ...


3
Carmen D Burns: High density lead-on-package fabrication method and apparatus. Staktek Corporation, Fulbright & Jaworski, January 16, 1996: US05484959 (99 worldwide citation)

The present invention provides a method and apparatus for fabricating thermally and electrically improved electronic integrated circuits by laminating one or more lead frames to a standard integrated circuit package such as, for example, thin small outline package (TSOP). The lead frame laminated to ...


4
Carmen D Burns: Hermetically sealed ceramic integrated circuit heat dissipating package. Staktek Corporation, Fulbright & Jaworski L, November 5, 1996: US05572065 (95 worldwide citation)

A method and apparatus for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and ex ...


5
Carmen D Burns: Process for hermetically encapsulating semiconductor devices. National Semiconductor Corporation, Gail W Woodward, James A Sheridan, Neil B Schulte, October 26, 1982: US04355463 (94 worldwide citation)

A tape assembly process attaches semiconductor chips to a tape via thermocompression gang bonding and the tape is wound onto a reel. The tape is fabricated during its manufacture to have a plurality of spaced finger array patterns. The inner finger ends are located so as to mate with the bonding pad ...


6
Carmen D Burns: Bus communication system for stacked high density integrated circuit packages. Staktek Corporation, Fulbright & Jaworski L, September 3, 1996: US05552963 (86 worldwide citation)

The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically ...


7
Carmen D Burns, Jerry Roane, James W Cady: Ultra high density integrated circuit packages. Staktek Corporation, Fulbright & Jaworski L, August 27, 1996: US05550711 (83 worldwide citation)

Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The casing surrounding a die element may be reduce ...


8
Carmen D Burns: Ultra high density integrated circuit packages method and apparatus. Staktek Corporation, Fulbright & Jaworski, December 27, 1994: US05377077 (82 worldwide citation)

Thin and durable level-one and level-two integrated circuit packages are provided. A plurality of level-one integrated circuit packages may be aligned and securely bound in a stacked configuration by use of a flexible high temperature material, such as silicon adhesive tape or a conformal coating, t ...


9
Carmen D Burns: Ultra high density modular integrated circuit package. Staktek Corporation, Fulbright & Jaworski, May 30, 1995: US05420751 (82 worldwide citation)

A multiple-element modular package is provided which includes a plurality of level-one packages in horizontal or vertical stacked configuration.


10
Carmen D Burns: Bus communication system for stacked high density integrated circuit packages. Staktek Corporation, Fulbright & Jaworski, October 3, 1995: US05455740 (80 worldwide citation)

The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically ...